Reducing CO2 Emissions Through Products That Consume Less Power When in Use
As ICT grows more and more common, we expect there to be an increase in energy demand in proportion to the higher performance and higher-density integration of servers and other ICT products. Various countries and regions are also expanding their energy-related regulations for ICT products, and energy efficiency is taking on increasing social importance as a factor in energy label conformance and green procurement requirements.
Here at the Fujitsu Group, we believe that we should work to improve the energy performance of our products during their use, in order to reduce GHG emissions. As such, we will actively implement energy-saving technologies and continue working to further improve the energy efficiency of products. Through these efforts, we will work to promote the development of products that contribute to reduced power consumption when in use.
FY 2019 Performance
|Targets under the Fujitsu Group Environmental Action Plan (Stage IX)||FY 2019 Performance|
|Reduce CO2 emissions due to product power consumption by 14% or more in comparison to FY 2013.||Reduced by 23%|
Fujitsu Group Environmental Action Plan (Stage IX) Initiatives
Based on the Fujitsu Group’s medium-term environmental goal of “reducing CO2 emissions due to product power consumption in FY 2030 by 30% or more in comparison to FY 2013,” we set a target in the Fujitsu Group Environmental Action Plan (Stage IX) to reduce CO2 emissions due to product power consumption by 14% or more in comparison to FY 2013 in FY 2020, as a transitional year. To achieve this target, each business unit goals to improve the energy efficiency of products that were expected to be developed in FY 2019 and FY 2020, then worked to meet them. Applications of energy-saving technologies include new, high-efficiency microprocessors and power supplies, energy-saving displays, optimized energy-saving controls, and the strengthening of power management features. In addition to these, we are actively pushing for the aggregation of LSIs, reductions in the numbers of components, and the implementation of eco-friendly devices.
Attained a 23% Reduction in CO2 Emissions in Comparison to FY 2013
In FY 2019, as a result of applying and expanding energy-saving technologies in our servers, PCs, network devices, and imaging devices, we were able to attain a 23% reduction in CO2 emissions in comparison to FY 2013.
Working Toward Our Targets
In order to achieve the targets set in the Fujitsu Group Environmental Action Plan (Stage Ⅸ), each unit will work to further develop products with improved energy efficiency. We will also implement advanced energy-saving technologies and expand their application to our products, as part of our cross-Group policy to improve energy efficiency.
Looking toward the future, we aim to push the development of advanced eco-friendly devices, which will contribute to revolutionary improvements in energy efficiency and allow early product development.
Examples of Initiatives in FY 2019
The UBT-SP FC400, a Service Terminal for Financial Institutions Which is Scalable, Compact, and Energy-Efficient
The UBT-SP FC400 is a control unit that governs all of the service terminals for financial institutions. Equipped with a rich variety of external interfaces, including 13 USB ports, it can be connected to various peripheral devices, such as bankbook printers, slip scanners, and cash-handling devices used at service counters. The structure and design of the system allow it to be installed either vertically or horizontally, and respond flexibly to layout changes due to banks’ reviews of their operations.
We select high-quality components that can be used and supplied for a long period of time, and by implementing high reliability and long-term operation, which are features of our financial products, we are contributing to reduced environmental impact by extending the product replacement cycle.
We have also adopted the latest power-saving architecture and reduced the number of cooling fans by optimizing the arrangement of the heat sink fins and the internal structure, and we have reduced power consumption by 15% in comparison to the previous model.
Furthermore, we preserved scalability through the abundant interfaces, and figured out ways to drastically reduce the number of parts by adopting a single-board design for the internal printed circuit board and aiming to eliminate internal cables. By doing so, we reduced its weight by approximately 19% in comparison to the previous model, and were able to create one of the most compact, lightest products in the series.