We provide concurrent PCB design solution that integrate electrical and thermal fluid/stress simulations for customer's product developments.
We perform warpage analysis, using Cu ratio model based on the real PCB designs. We propose optimized PCB designs low warpages whether BGAs are used.
We optimize parts layout and trace pattern in terms of warpage reduction.
We propose optimal PCB designs with thermal analysis that integrate joule heat and device operating heat analysis.
Our optimized PCB design solutions for high performance applications reduce prototype cycles, lead-time, and cost.
Optimum materials, Layer structure and design rules
Waveform quality and timing of high-speed DDRx interface.
Check DC Drop and Input Impedance of Power Line for Digital Board.
Check VG plane resonance for Digital Board.
Minimize line width and Via diameter within target impedance(Z0) to increase routing channels.
Increase routing channels by replacing to smaller parts and displacing dumping registers.
Validate electrical performance by implementing transmission waveform simulation.
Layer count reduction with the compatible electrical performance and displacements of dumping registers enable cost-down of PCBs and PCBAs.
Concurrent PCB designs with multiple users reduce design cycles by half, minimizing the prototype development lead-time for customers.
FUJITSU INTERCONNECT TECHNOLOGIES helps customers solve the design issues.
We provide comprehensive design solutions for performance, miniaturization, and cooling in a wide range of products, devices and modules.
Board Size | 440 × 350mm |
---|---|
Structure | 24 Layers |
Device counts | 8,400 |
Device Pin counts | 39,000 pin |
Wire counts | 30,000 wires |
Board Size | 190 × 150mm |
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Structure | 6 Layers |
Device counts | 2,000 |
Device Pin counts | 6,000 pin |
Wire counts | 2,400 wires |
Board Size | 180 × 110mm |
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Structure | 4 Layers |
Device counts | 60 |
Device Pin counts | 250 pin |
Wire counts | 160 wires |
Board Size | 48 × 48mm |
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Structure | 18 Layers (6-6-6) |
IO counts of DIE | 19,500 pin |
BGA Pin counts | 2,100 pin |
Board Size | 110 × 130mm |
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Structure | 26 Layers (10-6-10) |
Device counts | 1,600 |
Device Pin counts | 36,800 pin |
Wire counts | 35,700 wires |
Board Size | φ440mm |
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Structure | 52 Layers
|
Device counts | 7,400 |
Device Pin counts | 25,600 pin |
Wire counts | 12,000 wires |
With our extensive experiences in a wide variety of areas, we offer value-added design solutions for our customers.
We provide total PCB design solutions that include a wide range of simulations. We interface design data to a large variety of tools for electrical, thermal, and stress-strain simulations to add values to our customer's products.
Design Tool | Main Product Application | |
---|---|---|
CAD | CR-5000 Board Designer (ZUKEN) | Consumer products |
Allegro Package Designer (Cadence) | Package substrates & testing | |
CADVANCE (ZUKEN) | Semiconductor testing | |
FUJITSU CAD | Concurrent PCB design with multi-users | |
CAM | InCAM (FrontLine) | Design rule check for manufacturing (DFM) |
PC-AutoCAM (Dynatron) | Optimization of design data (Gerber) |
Note) All company or product names mentioned above are trademarks or registered trademarks of their respective owners.
Simulation Tools | Main product application |
---|---|
DEMITASNX EMC Expert (NEC) | EMI Rule Check and VG plane resonance analysis for Digital Board |
Signal Adviser-SI (FUJITSU) | Signal Integrity Analysis for Digital Board |
Signal Adviser-PI (FUJITSU) | DC drop and Input Impedance Analysis of Power line for Digital Board |
HSPICE (SYNOPSYS) | Signal Integrity Analysis for Digital Board |
CST MICROWAVE STUDIO (CST) | Insertion Loss and Return Loss Analysis for Digital Signal Trace |
FloTHERM (Mentor) | Thermal flow analysis |
Abaqus (Dassault) | Stress-strain analysis |
Note) All company or product names mentioned above are trademarks or registered trademarks of their respective owners.
Our Design Centers are located in Japan and Vietnam, providing business efficiency and continuity to our customers.
We provide comprehensive solutions across all stage of the product development from circuit design through prototype development and evaluation to production.
The comprehensive strength of the FUJITSU Group brings additional value to our customer's product developments.
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