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Board Design

Best Solutions for Customer Problems Application Fields Design Tools and Environment Warpage improvements at reflow stress Countermeasure for thermal problems Signal quality improvements Parts and PCB layer-counts reduction Design cycles reduction ITS servers Automotive and mobiles Industry and power electronics Semiconductor Device testing CAD/CAM tools Simulation tools PCB Design Center

Best Solutions for Customer Problems Solutions for PCB Design Problems

We provide concurrent PCB design solution that integrate electrical and thermal fluid/stress simulations for customer's product developments.

Issue 1Design PCBs with low warpages

Examples of PCB stress-strain analysis

We perform warpage analysis, using Cu ratio model based on the real PCB designs. We propose optimized PCB designs low warpages whether BGAs are used.

Examples of PCB stress-strain analysis

We optimize parts layout and trace pattern in terms of warpage reduction.

Issue 2Design PCBs with joule heat analysis for high current applications

We propose optimal PCB designs with thermal analysis that integrate joule heat and device operating heat analysis.

1) Perform joule heat analysis with precise trace pattern modeling based on the real designs.

Perform joule heat analysis with precise trace pattern modeling based on the real designs

2) Improve trace flexibility with Embedded Bus Bar

Improve trace flexibility with Embedded Bus Bar

3) Place control logic and power devices on the same surface layer.

Place control logic and power devices on the same surface layer

Issue 3Realize stable operation for high performance PCBs

Our optimized PCB design solutions for high performance applications reduce prototype cycles, lead-time, and cost.

1) Propose suitable PCB specifications

Optimum materials, Layer structure and design rules

Propose suitable PCB specifications

2) Signal Integrity(SI)Analysis

Waveform quality and timing of high-speed DDRx interface.

Signal Integrity (SI) Analysis

3) Power Integrity(PI)Analysis

Check DC Drop and Input Impedance of Power Line for Digital Board.

Power Integrity (PI) Analysis

4) VG plane resonance analysis

Check VG plane resonance for Digital Board.

EMI analysis

Issue 4Reduce layer-count and electrical parts to satisfy the electrical performance.

1) Design Review

Minimize line width and Via diameter within target impedance(Z0) to increase routing channels.

Design Review

2) Layout Review

Increase routing channels by replacing to smaller parts and displacing dumping registers.

Layout Review

3) Validation with simulation

Validate electrical performance by implementing transmission waveform simulation.

Validation with simulation

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Layer count reduction with the compatible electrical performance and displacements of dumping registers enable cost-down of PCBs and PCBAs.

Issue 5Design cycles reduction

Concurrent PCB designs with multiple users reduce design cycles by half, minimizing the prototype development lead-time for customers.

Design cycles reduction

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FUJITSU INTERCONNECT TECHNOLOGIES helps customers solve the design issues.

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Application Fields Design Solution Fields

We provide comprehensive design solutions for performance, miniaturization, and cooling in a wide range of products, devices and modules.

High performance PCBs for Super Computers, ICT Infrastructure and Medical systems

Board Size 440 × 350mm
Structure 24 Layers
Device counts 8,400
Device Pin counts 39,000 pin
Wire counts 30,000 wires

High performance PCBs for Super Computers, ICT Infrastructure and Medical systems

High density PCBs for Automotive, mobile and IoT

Board Size 190 × 150mm
Structure 6 Layers
Device counts 2,000
Device Pin counts 6,000 pin
Wire counts 2,400 wires

High density PCBs for Automotive, mobile and IoT

Thick Cu PCBs for Industrial and Power electronics

(Thick Cu for high current use)

Board Size 180 × 110mm
Structure 4 Layers
Device counts 60
Device Pin counts 250 pin
Wire counts 160 wires

Thick Cu PCBs for Industrial and Power electronics

Semiconductor packaging substrates

Board Size 48 × 48mm
Structure 18 Layers (6-6-6)
IO counts of DIE 19,500 pin
BGA Pin counts 2,100 pin

Semiconductor packaging substrates

High layer count PCBs for Semiconductor tests

Board Size 110 × 130mm
Structure 26 Layers (10-6-10)
Device counts 1,600
Device Pin counts 36,800 pin
Wire counts 35,700 wires
Board Size φ440mm
Structure 52 Layers
 
Device counts 7,400
Device Pin counts 25,600 pin
Wire counts 12,000 wires

High layer count PCBs for Semiconductor tests

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With our extensive experiences in a wide variety of areas, we offer value-added design solutions for our customers.

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Design Tools and Environment Design Tools and Environment

We provide total PCB design solutions that include a wide range of simulations. We interface design data to a large variety of tools for electrical, thermal, and stress-strain simulations to add values to our customer's products.

CAE tools (CAD/CAE)

( ) Sales company
Design Tool Main Product Application
CAD CR-5000 Board Designer (ZUKEN) Consumer products
Allegro Package Designer (Cadence) Package substrates & testing
CADVANCE (ZUKEN) Semiconductor testing
FUJITSU CAD Concurrent PCB design with multi-users
CAM InCAM (FrontLine) Design rule check for manufacturing (DFM)
PC-AutoCAM (Dynatron) Optimization of design data (Gerber)

Note) All company or product names mentioned above are trademarks or registered trademarks of their respective owners.

Simulation Tools

( ) Sales company
Simulation Tools Main product application
DEMITASNX EMC Expert (NEC) EMI Rule Check and VG plane resonance analysis for Digital Board
Signal Adviser-SI (FUJITSU) Signal Integrity Analysis for Digital Board
Signal Adviser-PI (FUJITSU) DC drop and Input Impedance Analysis of Power line for Digital Board
HSPICE (SYNOPSYS) Signal Integrity Analysis for Digital Board
CST MICROWAVE STUDIO (CST) Insertion Loss and Return Loss Analysis for Digital Signal Trace
FloTHERM (Mentor) Thermal flow analysis
Abaqus (Dassault) Stress-strain analysis

Note) All company or product names mentioned above are trademarks or registered trademarks of their respective owners.

PCB Design Center

Our Design Centers are located in Japan and Vietnam, providing business efficiency and continuity to our customers.

PCB Design Center

Comprehensive Strength of the FUJITSU Group

We provide comprehensive solutions across all stage of the product development from circuit design through prototype development and evaluation to production.

Comprehensive strength of the FUJITSU Group

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The comprehensive strength of the FUJITSU Group brings additional value to our customer's product developments.

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