Microelectronics : Fujitsu Global

Home >
News >
Press Releases >
Archives >
By Topic >
2009 >
Microelectronics

Press Releases
- Recent
- Archives
  - By Month
  - By Topic
    - 2012
    - 2011
    - 2010
    - 2009
    - 2008
    - 2007
    - 2006
    - 2005
    - 2004
    - 2003
    - 2002
  - By Region
- Fujitsu News Wire
Press Contacts
Notices
Events
Publications
Awards

Microelectronics

11 December 2009 Japan: Fujitsu Succeeds in World's First Operation of 100W-Class Amplifiers Employing Carbon Nanotubes for Next-Generation Mobile Base Stations
Kawasaki, Japan, December 11, 2009 – Fujitsu Laboratories Ltd. today announced that, using carbon nanotubes as heat-dissipation material in amplifier transistors, Fujitsu has become the first to achieve the successful operation of high-frequency, high-power (100W-class) flip-chip amplifiers employing carbon nanotubes, for mobile base stations designed for fourth-generation (4G, IMT-Advanced) systems. Fujitsu achieved high frequency, high output, and high amplification in the amplifiers by developing "dual-side heat-dissipation" technology, in which heat is dissipated through both sides of the transistor chip, which is the source of the amplifier's heat output. Furthermore, Fujitsu's new technology enables the reduction of the transistor chip size to less than two-thirds (2/3) the size of existing transistor chips. Details of this new technology were presented at the IEEE International Symposium on Radio-Frequency Integration Technology 2009 (RFIT 2009) held from December 9 to 11 in Singapore, at which Fujitsu Laboratories was awarded the RFIT 2009 Best Paper for Oral Presentation award.
3 December 2009 The Netherlands: 24V driven receipt/journal printer
Hoofddorp, December 3, 2009 – Fujitsu Components Europe releases two new ultra low profile, 24V, receipt and journal printer units that can either be combined together into one modular unit, or mounted separately for design and installation flexibility.
27 November 2009 Japan: Fujitsu Develops World's First Technology for Low-Temperature Full-Surface Direct Formation of Graphene Transistors on Large-Scale Substrates
Kawasaki, Japan, November 27, 2009 – Fujitsu Laboratories Ltd. today announced, as a world first, the development of a novel technology for forming graphene transistors directly on the entire surface of large-scale insulating substrates at low temperatures while employing chemical-vapor deposition (CVD) techniques which are in widespread use in semiconductor manufacturing. Compared to the temperatures of 800-1000°C at which graphene is formed with conventional methods, Fujitsu has succeeded in significantly lowering the graphene fabrication-temperature to 650 °C, thus allowing for graphene transistors to be formed directly on a variety of insulator substrates, including substrates that are sensitive to the higher temperatures. Graphene is a nano-scale carbon material (nano-carbon) with the potential to be the material used in next-generation low-voltage, low-power transistors, as graphene features high-electron and hole mobility characteristics.
19 November 2009 USA: Symmetry Electronics and Fujitsu Microelectronics America Announce New Distribution Agreement for the Americas
Hawthorne and Sunnyvale, Calif., November 19, 2009 – Symmetry Electronics and Fujitsu Microelectronics America Announce New Distribution Agreement for the Americas
17 November 2009 Singapore: Fujitsu Announces Fast-Response DC/DC Converter IC for Consumer Electronics
Singapore, November 17, 2009 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced a new two-channel DC/DC converter IC with fast transient response, for use in digital consumer products, such as LCD TVs and digital video recorders. This new DC/DC converter IC, the MB39A145, utilizes a “bottom detection comparator method”, and includes new enhanced circuits which provide changes in voltage, for changes in current to realize a more stable and low ripple output voltage.
16 November 2009 Japan: Fujitsu Announces Fast-Response DC/DC Converter IC for Consumer Electronics
Tokyo, November 16, 2009 – Fujitsu Microelectronics Limited today announced a new two-channel DC/DC converter IC with fast transient response, for use in digital consumer products, such as LCD TVs and digital video recorders. This new DC/DC converter IC, the MB39A145, utilizes a “bottom detection comparator method”, and includes new enhanced circuits which provide changes in voltage, for changes in current to realize a more stable and low ripple output voltage. This improved stability subsequently reduces the number of external components that are needed, such as condensers, thus reducing space. The IC also includes Pulse Frequency Modulation (PFM) that is highly efficient in low-current ranges, and allows the equipment to have low power consumption in stand-by mode. Samples of the new converter IC will be available from January 2010.
27 October 2009 USA: Fujitsu’s New Printer Mechanism Offers Top-of-Line Speed and Reliability
Sunnyvale, CA, October 27, 2009 – Fujitsu Components America, Inc. today added a 24-volt, 3-inch thermal printer mechanism that offers OEMs ultra-fast print speeds, long-term operating reliability, and a compact footprint. These features reduce operating costs and downtime by increasing transaction efficiency in high-volume receipt printing applications.
30 September 2009 Japan: Fujitsu Develops World's First Millimeter-Wave Gallium-Nitride Transceiver Amplifier Chipset
Tokyo and Kawasaki, September 30, 2009 – Fujitsu Limited and Fujitsu Laboratories Ltd. announced today the development of the world's first gallium-nitride (GaN) HEMT-based transceiver amplifier chipset for broadband wireless transmission equipment operating in the millimeter bandwidth, the range of 70 to 100 GHz, for which widespread usage is expected to grow.
16 September 2009 Singapore: Fujitsu Launches Multimode, Multiband RF Transceiver IC
Singapore, September 16, 2009 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced the first product in its entry into the mobile phone RF transceiver market, in launching a RF transceiver IC for mobile phones supporting 2G GSM/GPS/EDGE and 3G UMTS/HSPA protocols, that includes a 3G DigRF(*1) interface on a single chip.
14 September 2009 USA: Fujitsu Microelectronics Now Shipping Industry’s First 3G SAW-less Transceiver: a New Multimode, Multiband UMTS/ GPRS/EDGE Solution
Sunnyvale, Calif. , September 14, 2009 – Fujitsu Microelectronics Now Shipping Industry’s First 3G SAW-less Transceiver: a New Multimode, Multiband UMTS/ GPRS/EDGE Solution
14 September 2009 Japan: Fujitsu Launches Multimode, Multiband RF Transceiver IC
Tokyo, September 14, 2009 – Fujitsu Microelectronics Limited today announced the first product in its entry into the mobile phone RF transceiver market, in launching a RF transceiver IC for mobile phones supporting 2G GSM/GPS/EDGE and 3G UMTS/HSPA protocols, that includes a 3G DigRF interface on a single chip. The compact new transceiver IC also eliminates the need for external SAW filters and low-noise amplifiers (LNA), and enables mobile phone manufacturers to reduce component count, board space and bill of materials. Additionally, a new simplified programming model helps to significantly reduce development time and simplify integration of the RF into a radio platform. Samples of the MB86L01A transceiver IC are available from today.
27 August 2009: Fujitsu Microelectronics and TSMC to Collaborate on 28nm Process Technology
Tokyo and Hsin-chu, Taiwan, August 27, 2009 – Fujitsu Microelectronics Limited and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that they have agreed to collaborate on 28-nanometer (nm) process technology targeted for foundry production of Fujitsu Microelectronics’ 28nm logic ICs and to jointly develop an enhanced 28nm high-performance process technology by utilizing TSMC’s advanced technology platform.
27 August 2009 Japan and Taiwan: Fujitsu Microelectronics and TSMC to Collaborate on 28nm Process Technology
Tokyo and Hsin-chu, Taiwan , August 27, 2009 – Fujitsu Microelectronics Limited and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that they have agreed to collaborate on 28-nanometer (nm) process technology targeted for foundry production of Fujitsu Microelectronics’ 28nm logic ICs and to jointly develop an enhanced 28nm high-performance process technology by utilizing TSMC’s advanced technology platform. Previously, both companies announced that Fujitsu Microelectronics will collaborate with TSMC on 40nm production. This will extend Fujitsu Microelectronics’ 40nm collaboration with TSMC and covers joint development of an optimized 28nm high-performance process technology. Initial 28nm samples are expected to ship toward the end of 2010.
27 July 2009 USA: Fujitsu Now Shipping USB 3.0-SATA Bridge IC for PC Peripherals Supporting SuperSpeed USB 3.0
Sunnyvale, Calif. , July 27, 2009 – Fujitsu Now Shipping USB 3.0-SATA Bridge IC for PC Peripherals Supporting SuperSpeed USB 3.0
27 July 2009 Singapore: Fujitsu Releases New USB 3.0 - SATA Bridge IC for PC Peripherals
Singapore, July 27, 2009 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced the new USB 3.0 - SATA (*1) bridge (*2) ICs, built with Fujitsu’s leading-edge proprietary physical layer device (PHY). It supports SuperSpeed USB, the USB 3.0 specification (*3), and enables data transfer rates of 5Gbps maximum between external storage devices – such as hard disk drives (HDDs) – and PCs.
27 July 2009 The Netherlands: Touch panel protector sheets
Hoofddorp, July 27, 2009 – Fujitsu Components Europe B.V., releases the new self-wetting adhesive protector sheets for touch screens and flat panel displays.
27 July 2009 Japan: Fujitsu Ships USB 3.0 - SATA Bridge IC for PC Peripherals
Tokyo, July 27, 2009 – Fujitsu Microelectronics Limited today announced the shipment of one of the first available USB 3.0 - SATA(1)bridge(2) ICs in the market, which supports SuperSpeed USB, the USB 3.0 specification(3), and enables data transfer rates of 5Gbps maximum between external storage devices – such as hard disk drives (HDDs) – and PCs. The new IC, the MB86C30A, is the first in the MB86C30 Series of USB 3.0-SATA bridge ICs, and when embedded in PC peripheral devices, enables over 10-fold faster data transfer rates in comparison to the USB 2.0 specification. In addition to the bridge functionality, the new IC also features a high-speed data encryption/decryption engine, offering high security without impairing the high-speed performance of USB 3.0. Samples of the new MB86C30A IC are available from today, July 27, 2009.
21 July 2009 USA: Digi-Key Corporation and Fujitsu Microelectronics Announce Worldwide Distribution Agreement
Thief River Falls, Minn. and Sunnyvale, Calif., July 21, 2009 – Digi-Key Corporation and Fujitsu Microelectronics Announce Worldwide Distribution Agreement
15 July 2009 USA: Fujitsu Microelectronics Now Offering New, Low-pin-count 8-bit Flash MCU Family, Ideal for Cost-Sensitive Consumer Appliance Applications
Sunnyvale, CA, July 15, 2009 – Fujitsu Microelectronics Now Offering New, Low-pin-count 8-bit Flash MCU Family, Ideal for Cost-Sensitive Consumer Appliance Applications
24 June 2009 Japan: Fujitsu Develops World's First Gallium-Nitride HEMT for Power Supply
Kawasaki, Japan, June 24, 2009 – Fujitsu Laboratories Ltd. today announced the development of a new structure for gallium-nitride high electron-mobility transistors (GaN)(HEMT) that can minimize power loss in power supplies, thus enabling reduced power consuFmption of electronic equipment such as IT hardware and home electronics. The new technology blocks the flow of current from power supplies in stand-by mode and produces high-density current when turned on (on-state current), and has the potential to cut power consumption of electronic equipment by one-third. If applied to data centers, Fujitsu's new GaN HEMT would be able to reduce total power consumption by 12%, thereby resulting in the effect of removing 330,000 tons of CO2 from Japan as a whole.
18 June 2009 The Netherlands: Solar Relays for a Sunny Future
Hoofddorp, June 18, 2009 – Fujitsu Components™ product range contains power relays that are recommended to be used in solar energy systems.
12 June 2009 Japan: Fujitsu Develops World's First 100 W-Class X-band High-Output Amplifier Featuring High Efficiency Exceeding 50%
Kawasaki, Japan, June 12, 2009 – Fujitsu Laboratories Limited today announced the development of the world's first 101-watt (101-W) X-band high-output amplifier achieving the world's highest efficiency of 53% using gallium nitride (GaN) high electron-mobility transistors (HEMTs).
11 June 2009 Japan: Fujitsu Achieves World's First Impulse Radio-Based Millimeter-Band Transmissions Exceeding 10 Gbps
Tokyo and Kawasaki, Japan, June 11, 2009 – Fujitsu Limited and Fujitsu Laboratories Ltd. today announced the development of the world's first impulse radio-based high-capacity wireless transmission equipment using millimeter-band transmissions in the 70-100 gigahertz (70-100 GHz) range band, resulting in throughput exceeding 10 gigabits-per-second (10 Gbps). This technology dispenses with the oscillators and other components that have been required in conventional wireless transmission technologies, enabling compact and inexpensive millimeter-band transmission equipment. The new technology is suitable as an alternative to fiber-optic trunk lines in regions where those lines would be difficult to lay, as a way to bridge the digital divide, and can also be used for ultra-fast wireless LANs.
2 June 2009 USA: Fujitsu Leads Project Team to Deliver WiMAX VoIP Devices to Smile Communications to Serve Developing Countries
Tokyo, Japan and Johannesburg, South Africa, June 2, 2009 – Fujitsu Leads Project Team to Deliver WiMAX VoIP Devices to Smile Communications to Serve Developing Countries
2 June 2009 Germany: Fujitsu Exhibits Comprehensive Range of WiMAX Solutions
Langen, Germany and Amsterdam, June 2, 2009 – Come and meet Fujitsu on Stand 3.22
2 June 2009 Germany: Fujitsu Expands WiMAX Terminal Ecosystem with Teltonika
Langen, Germany and Amsterdam, June 2, 2009 – Fujitsu Expands WiMAX Terminal Ecosystem with Teltonika
2 June 2009 Japan, South Africa, EMEA: Fujitsu Leads Project Team to Deliver WiMAX VoIP Devices to Smile Communications to Serve Developing Countries
Tokyo, Japan and Johannesburg, South Africa, June 2, 2009 – Fujitsu Microelectronics Limited and Smile Telecoms Holdings Limited today announced the realization of the world's first WiMAX Voice-over-IP (VoIP) phone and service for developing countries, enabled through the creation of an eco-system encompassing mobile carrier, handset, semiconductor and module partners.
26 May 2009 Germany: Fujitsu and ADD Collaborate to Bring Advanced Metering Solutions to Market
Langen, Germany, May 26, 2009 – Companies sign MoU to develop PRIME based SoCs for AMM market
22 May 2009 Singapore: Fujitsu Launches World’s First 125°C Spec. Low Power Memory for SiPs
Singapore, May 22, 2009 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced the launch of two new Consumer FCRAM(*1) memory chips featuring an operating temperature range that has been extended to a high-temperature of 125°C for the first time in memory with a DDR SDRAM interface.
19 May 2009 Japan: Fujitsu Launches World’s First 125°C Spec. Low Power Memory for SiPs
Tokyo, May 19, 2009 – Fujitsu Microelectronics Limited today announced the launch of two new Consumer FCRAM memory chips featuring an operating temperature range that has been extended to a high-temperature of 125°C for the first time in memory with a DDR SDRAM interface. Sample shipment of the two new FCRAM products, the 512Mbit (MB81EDS516545), and 256Mbit (MB81EDS256545), will begin from today. These products are low power consumption memory optimized for use in system-in-packages (SiPs) in digital consumer products such as digital TVs and digital video camcorders.
13 May 2009 Singapore: Fujitsu Releases New Full HD H.264/MPEG-2 Transcoder ICs
Singapore, May 13, 2009 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced 2 new transcoder ICs that can convert between Full HD (1920 dots x 1080 lines) MPEG-2 (*1) video data and H.264 (*2) video data, as well as transcoding between audio formats while featuring a low power consumption of only 1.0Watt(W) including the in-package memory. These new ICs are targeted to support the growing number of electronic equipment that can record digital broadcasts.
8 May 2009 Japan: Fujitsu Releases New Full HD H.264/MPEG-2 Transcoder ICs
Tokyo, May 8, 2009 – Fujitsu Microelectronics Limited today announced 2 new transcoder ICs that can convert between Full HD (1920dots x 1080lines) MPEG-2 video data and H.264 video data, as well as transcoding between audio formats while featuring a low power consumption of only 1.0Watt(W) including the in-package memory. These new ICs are targeted to support the growing number of electronic equipment that can record digital broadcasts. By employing Fujitsu’s proprietary transcode technology, Fujitsu Microelectronics realized industry-leading low power consumption. Combined with the small form-factor packaging, these ICs can be used not only for non-mobile fixed electronic equipment – such as digital video recorders (DVRs) - but also in such mobile products such as notebook PCs. In addition to the transcode function, security functions are included on a single chip to make it easy for customers to create their systems. Sample shipment of the new transcoder ICs, the MB86H57 and MB86H58, will begin from late July, 2009.
6 May 2009 USA: New Technology Backgrounder from Fujitsu Microelectronics Describes the Advantages of the 1394 Automotive Standard for In-Vehicle Networks
Sunnyvale, CA, May 6, 2009 – Details on New MB88395 Controller for 1394 Automotive Networking Applications
5 May 2009 USA: Fujitsu Addresses Alternative Energy Markets; Develops Relays for Solar Powered and Power Saving Applications
Sunnyvale, CA, May 5, 2009 – Fujitsu Components America, Inc. today announced it is developing new electromechanical relays to target Alternative Energy Markets. The company is initially offering two high-voltage, high-current, high-insulation power relays and one low-profile, power latching relay for energy management applications in solar powered systems and smart power meters.
30 April 2009 Japan and Taiwan: Fujitsu Microelectronics and TSMC to Collaborate on Leading-edge Process Technology
Tokyo, Japan and Hsin-Chu, Taiwan, April 30, 2009 – Fujitsu Microelectronics Limited and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that they will collaborate on leading-edge process technology production for the manufacturing of Fujitsu Microelectronics’ products. Under an agreement between the companies, Fujitsu Microelectronics will expand its 40-nanometer generation logic IC business with production at TSMC’s fabs.
28 April 2009 USA: Fujitsu’s New Receipt/Journal Printer Series Offers Modular Design Options
Sunnyvale, CA, April 28, 2009 – Fujitsu Components America, Inc. today released a new series of ultra low-profile, 24V, receipt and journal printer units that can either be combined together into one modular unit, or mounted separately for design and installation flexibility. Target applications include mini kiosks, banking and POS terminals, and scientific and medical equipment.
23 April 2009 Singapore: Fujitsu Launches World’s First 1394 Automotive IC for HD Video
Singapore, April 23, 2009 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced the world’s first “1394 Automotive” (IDB-1394) controller IC that realizes high-definition (HD) (1,280 dots x 720 lines) video transmission over the IDB-1394 in-vehicle multimedia network protocol. The new IC, the MB88395, can simultaneously transmit multiple streams around the vehicle, such as HD video from Blu-Ray DVDs, digital TV, audio and car navigation images.
22 April 2009 USA: Fujitsu Microelectronics Launches World’s First 1394 Automotive Controller for HD Video in Vehicle Networks
Sunnyvale, CA, April 22, 2009 – Contributes to reduced costs, lighter wiring harness, and higher fuel efficiency
22 April 2009 Japan: Fujitsu Launches World’s First 1394 Automotive IC for HD Video
Tokyo, April 22, 2009 – Fujitsu Microelectronics Limited announced today the launch of the world’s first “1394 Automotive”(IDB-1394) controller IC that realizes high-definition (HD) (1,280 dots x 720 lines) video transmission over the IDB-1394 in-vehicle multimedia network protocol. The new IC, the MB88395, can simultaneously transmit multiple streams within the vehicle, such as HD video from Blu-ray DVDs, digital TV, audio and car navigation images. The new IC realizes this by utilizing a high-speed 800Mbps physical layer as well as Fujitsu’s proprietary SmartCODEC that provides high compression and which can transmit HD video without perceptible lag. This not only brings the rich HD experience to rear-seat entertainment, but reduces the system cost of in-vehicle multimedia networks by a maximum of 30%, while reducing the number of wire harnesses (cables) by a maximum of 70% to reduce vehicle weight and improve fuel efficiency. Sample shipment of the new MB88395 will begin from April 22, 2009.
17 April 2009 Japan: Fujitsu Develops Secure USB Memory Device Featuring Automatic Data-Erase Function
Kawasaki, Japan and Sunnyvale, U.S., April 17, 2009 – Fujitsu Laboratories Limited and Fujitsu Laboratories of America, Inc. today announced the development of two new technologies designed to prevent the unwanted disclosure of data from lost universal serial bus (USB) memory devices and prevent uploads to file-sharing networks: a USB memory device technology that after a fixed period of time automatically erases data stored on the USB memory, and a file redirect technology which ensures that the data from the USB memory device can only be stored on a specified server. This creates a secure environment that protects confidential information and allows USB memory devices to be used as a convenient way to safely carry customer data back to one's own company to manage the data.
14 April 2009 Singapore: Fujitsu Expands Lineup of Low Pin Count 8-bit Microcontrollers for Consumer Appliances
Singapore, April 14, 2009 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced three new series to expand its lineup of low pin count (LPC) microcontrollers, with 8, 16, and 20 pins, in its F2MC-8FX family of high-performance 8-bit microcontrollers. The new MB95260H series, MB95270H series, and MB95280H series feature embedded dual-operation flash memory and support EEPROM emulation (*1). This enables a reduction in system cost, as an external EEPROM is not required. The launch of the three new series is in response to the rapid rise in demand in the Asian market for low pin count microcontrollers for use in home appliances and other consumer electronics. Samples of the new series will start shipping from April 14, 2009.
14 April 2009 Japan: Fujitsu Expands Lineup of Low Pin Count 8-bit Microcontrollers for Consumer Appliances
Tokyo, April 14, 2009 – Fujitsu Microelectronics Limited announced today three new series to expand its lineup of low pin count microcontrollers, with 8, 16, and 20 pins, in its F²MC-8FX family of high-performance 8-bit microcontrollers. The new MB95260H series, MB95270H series, and MB95280H series feature embedded dual-operation flash memory and support E²PROM emulation. This enables a reduction in system cost, as an external E²PROM is not required. The launch of the three new series is in response to the rapid rise in demand in the Asian market for low pin count microcontrollers, for use in home appliances and other consumer electronics. Samples of the new series will start shipping from April 14, 2009.
9 April 2009 USA: Fujitsu Expands Thermal Printer Offering with Standalone Receipt Printer Family
Sunnyvale, CA, April 9, 2009 – A new family of compact, single-station thermal receipt printers debuted today from Fujitsu Components America, Inc. The high-speed, standalone units are optimized to improve throughput efficiency and reduce the total cost of ownership of self-service and kiosk systems, as well as gaming, scales, voting and medical applications.
7 April 2009 USA: New White Paper from Fujitsu Microelectronics Describes PSP Model Technology in RF CMOS Design
Sunnyvale, CA, April 7, 2009 – Fujitsu Microelectronics America, Inc. (FMA) today published a new white paper entitled “The PSP Model in RF CMOS Design.”
27 March 2009 Japan: Notice Regarding Conversion of FDK into Consolidated Subsidiary
Tokyo, March 27, 2009 – Notice Regarding Conversion of FDK into Consolidated Subsidiary
27 March 2009 Japan: Notice Regarding Policy to Support Fujitsu Component Through Subscription to Preferred Shares
Tokyo, March 27, 2009 – Notice Regarding Policy to Support Fujitsu Component Through Subscription to Preferred Shares
18 March 2009 Japan: Fujitsu Begins On-Line Consumer Sales of World’s First Color E-Paper Mobile Terminal FLEPia
Tokyo and Kawasaki, March 18, 2009 – Fujitsu Frontech Limited and Fujitsu Laboratories Limited today announced the start of consumer sales in Japan of the world’s first color e-paper mobile terminal, FLEPia, available for purchase from today through Fujitsu Frontech’s online store “FrontechDirect”. Developed by Fujitsu Frontech and Fujitsu Laboratories, FLEPia is the first ever mobile information terminal to feature color electronic paper (color e-paper). In addition to being lightweight and thin, the color e-paper mobile terminal features an easy-to-view 8-inch display screen capable of showing up to 260,000 colors in high-definition, in addition to being equipped with Bluetooth and high-speed wireless LAN. FLEPia is also power-efficient, enabling up to 40 hours of continuous battery operation when fully charged, and does not require power for continuous display of a screen image, consuming power only during re-draw. Featuring significant storage capabilities, when used with a 4GB SD card, the color e-paper terminal can store the equivalent of 5,000 conventional paper-based books when each book is 300 pages long at 600KB per book, thus being environmentally friendly.
10 March 2009 Singapore: Fujitsu Launches Graphics Controller for Digital Dashboards & Car Navigation
Singapore, March 10, 2009 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced the launch of a new graphics controller for automotive infotainment systems, such as next-generation car navigation and digital dashboards. The new controller, the MB86298, offers the highest-class graphics capability for embedded systems, as well as an industry first of providing output to up to 4 displays, and up to 4 video inputs.
3 March 2009 Germany: Fujitsu adds 48-pin Versions to its 16FX Family of MCUs for Automotive and Industrial Applications
Langen and Nuremberg, Germany, March 3, 2009 – Fujitsu adds 48-pin Versions to its 16FX Family of MCUs for Automotive and Industrial Applications
3 March 2009 Germany: Fujitsu Announces 32-bit Flash Microcontroller Series for Use in Automotive and Industrial Applications
Langen and Nuremberg, Germany, March 3, 2009 – Fujitsu Announces 32-bit Flash Microcontroller Series for Use in Automotive and Industrial Applications
3 March 2009 Germany: Fujitsu Announces New Graphics Controller for Automotive and Industrial Embedded Display Systems
Langen and Nuremberg, Germany, March 3, 2009 – Fujitsu Announces New Graphics Controller for Automotive and Industrial Embedded Display Systems
3 March 2009 Germany: Fujitsu Demonstrates Extensive Range of Technology Solutions at Embedded World 2009
Langen and Nuremberg, Germany, March 3, 2009 – Fujitsu Demonstrates Extensive Range of Technology Solutions at Embedded World 2009
3 March 2009 Japan: Fujitsu Launches Graphics SoC for Digital Dashboards and Car Navigation
Tokyo, March 3, 2009 – Fujitsu Microelectronics Limited today announced the launch of a new graphics controller System-on-Chip (SoC) for automotive infotainment systems, such as next-generation car navigation and digital dashboards. The new controller, the MB86298, offers the highest-class graphics capability for embedded systems, as well as an industry first of providing output to up to 4 displays, and up to 4 video inputs.
26 February 2009 USA: New Technology Backgrounder from Fujitsu Microelectronics Describes Advances and Advantages of New Digital Touch Sensor Technology in a Wide Range of Application
Sunnyvale, CA, February 26, 2009 – Fujitsu Microelectronics America, Inc. (FMA) today published a new technical backgrounder entitled ‘’Touch Sensor Controller Technology and Application Trends.
24 February 2009 Germany: Fujitsu Introduces Evaluation Kit for 56GSa/s 8-Bit CHAIS ADC Technology
Langen, Germany, February 24, 2009 – Fujitsu Introduces Evaluation Kit for 56GSa/s 8-Bit CHAIS ADC Technology
23 February 2009 USA: Fujitsu Microelectronics Now Marketing Touch Sensor Controller for Portable Device Access and Navigation, Health Care Systems, Home Appliances
Sunnyvale, CA, February 23, 2009 – New Green, Low-power FMA1127 Touch Sensor Controller from ATLab Converts Capacitance to Digital Data
23 February 2009 Japan: Fujitsu Wins Award at Nano Tech 2009 for IT and Electronics
Tokyo and Kawasaki, Japan, February 23, 2009 – Fujitsu Limited and Fujitsu Laboratories Limited today announced that they have been awarded the IT and Electronics Award at the nano tech 2009 International Exhibition and Conference, the largest international nanotechnology exhibition, held in Tokyo from February 18 to February 20. At an awards ceremony held in Tokyo, Professor Tomoji Kawai, Chairman of the nano tech Executive Committee, stated that the IT and Electronics Award was awarded to the companies for their proposals of various applications of nano-carbon materials - such as carbon nanotube (CNT) transistors, CNT interconnects, and CNT-graphene composites - for semiconductor electronics, and their potential for paving the way toward the realization of "carbon electronics" comprised of carbon-based structural elements.
23 February 2009 Germany: Fujitsu Now Marketing High-Performance, Low Power Touch Sensor Controller
Langen, Germany, February 23, 2009 – Fujitsu Now Marketing High-Performance, Low Power Touch Sensor Controller
20 February 2009 USA: New White Paper from Fujitsu Microelectronics Highlights the Development of Mobile WiMAX Subscriber Solutions
Sunnyvale, CA, February 20, 2009 – Defines Strategies to Meet Demands for Versatile, Low-Power, Multi-Band Devices that Operate with Multiple Wireless Technologies and Operating Systems
19 February 2009 The Netherlands: Fujitsu Components & Fujitsu Isotec Teamwork
Hoofddorp, February 19, 2009 – Fujitsu Components Europe B.V. is proud to announce that they are appointed as official distributor for the Fujitsu Isotec Ltd. thermal printer range on the EMEA market.
18 February 2009 The Netherlands: Fujitsu FTR-J2 - Ultra Small High Voltage DC Relay
Hoofddorp, February 18, 2009 – Fujitsu Components Europe B.V., releases the FTR-J2 relay; the high voltage DC power relay.
16 February 2009: New WiMAX Baseband SoC from Fujitsu Microelectronics Enables Smallest USB Adapters and Embedded Mini Cards for Mobile WiMAX Designs
Sunnyvale, CA, and Barcelona, February 16, 2009 – New WiMAX Baseband SoC Delivers Low Power, Small Footprint Required for Innovative Netbooks, Handheld Devices
16 February 2009 Germany: Fujitsu Announces WiMAX Baseband Device for Mobile PCs
Langen, Germany and Barcelona, Spain, February 16, 2009 – Fujitsu Announces WiMAX Baseband Device for Mobile PCs
16 February 2009 Germany: Fujitsu to Demonstrate WiMAX with Adaptive Beamforming Using Cisco Base-Station at Mobile World Congress 2009
Langen, Germany and Barcelona, Spain, February 16, 2009 – Fujitsu to Demonstrate WiMAX with Adaptive Beamforming Using Cisco Base-Station at Mobile World Congress 2009
16 February 2009 Germany: Visit Fujitsu and Experience 2nd Generation Mobile WiMAX at Mobile World Congress
Langen, Germany and Barcelona, Spain, February 16, 2009 – Visit Fujitsu and Experience 2nd Generation Mobile WiMAX at Mobile World Congress
16 February 2009 Japan: Fujitsu Launches WiMAX Baseband LSI for Mobile PCs
Tokyo, February 16, 2009 – Fujitsu Microelectronics Limited today announced the launch of a Mobile WiMAX baseband LSI targeted for the expanding mobile PC market. The new LSI features an approximate 60% size reduction compared to Fujitsu Microelectronics’ previous Mobile WiMAX baseband LSI for mobile PCs. Samples of this new LSI, MB86K23, will start shipping from April 2009. By combining this new LSI with Fujitsu Microelectronics’ previously-announced RF LSI, MB86K52, and power management LSI, MB39C316, WiMAX USB dongles featuring the smallest form-factor level in the world can be realized.
13 February 2009 Japan and US: Fujitsu Laboratories Develops CMOS Transmitter IC for 40Gbps Optical Transmission Systems
Kawasaki and Tokyo, Japan and Sunnyvale, U.S., February 13, 2009 – Fujitsu Laboratories Limited, Fujitsu Laboratories of America, Inc., and Fujitsu Limited today announced the development of the world's first 65 nanometer (65nm) standard CMOS technology-based transmitter IC (serializer) for 40 gigabits-per-second (40Gbps) trunk-line optical transmission systems. New circuit technologies were developed, for the realization of high-speed signal generation circuits capable of handling 40Gbps transmissions, in addition to enabling stable generation of 40Gbps output signals, within power voltage fluctuation ranges required for practical use. This is the first realization ever of a CMOS-based transmitter for optical transmission systems that integrates on a single chip the I/O interface, signal processing, and high-speed signal generation that are all necessary for 40Gbps transmissions. As the first-ever single-chip integration of these multiple functions on a 40Gbps transmitter IC, this new transmitter IC will contribute significantly to the realization of power-efficient, low-cost, and compact optical transmission systems.
12 February 2009 Japan: Fujitsu Laboratories Develops CMOS-Based RF Transceiver Chip for 77GHz Automotive Radar
Kawasaki, Japan, February 12, 2009 – Fujitsu Laboratories Limited today announced the development of the world’s first radio frequency (RF) transceiver chip produced with 90 nm CMOS process technology that operates at the 77 gigahertz (77GHz) frequency, designed for use in automotive radars. The new transceiver chip includes several novel miniaturization technologies from Fujitsu Laboratories, including circuit design that employs inductor elements, and a newly developed signal-distribution circuit that utilizes magnetic field coupling. With a die size of 1.2 mm x 2.4 mm, this is the smallest example of a CMOS-based transceiver for the millimeter-band RF that has been reported thus far at an academic conference.
12 February 2009 Japan and US: Fujitsu Laboratories Develops Multi-Channel High-Speed Transceiver Circuit for High-Speed Blade Server Performance
Kawasaki, Japan and Sunnyvale, U.S., February 12, 2009 – Fujitsu Laboratories Limited and Fujitsu Laboratories of America, Inc. today announced the development of a power-efficient and compact multiple-channel high-speed transceiver circuit, that enables high-speed transmission at 10 gigabits-per-second (10Gbps) when used in backplanes which are circuit boards that act as transmission conduits of blade servers, which are high-performance servers that combine several servers. Compared to conventional technology, this novel backplane transceiver circuit would require only one-fourth (1/4) the power consumption and just half the area, to act as transmission conduits to enable 4-channel 10Gbps transmission in backplanes. It is anticipated that the new transceiver circuits will be employed in backplanes to meet the increasing need for blade server systems featuring high-density packaging, high-speed transmissions, and lower power consumption.
11 February 2009 The Netherlands: Seiki Sato New President Of Fujitsu Components Europe
Hoofddorp, February 11, 2009 – Fujitsu announces that mr. Sato has been appointed as the new president of FujitsuComponents Europe.
30 January 2009 Japan: Fujitsu Microelectronics to Reorganize Manufacturing Facilities
Tokyo, January 30, 2009 – Fujitsu Microelectronics Limited, since its establishment as a wholly owned subsidiary of Fujitsu Limited in March 2008, has been implementing a medium-term business plan that includes raising production efficiency and optimizing costs in its LSI manufacturing divisions. However, with the rapid worsening of economic conditions worldwide, orders have decreased significantly since October 2008.　The company has therefore deemed it necessary to reorganize and consolidate its LSI wafer manufacturing facilities.
27 January 2009 Germany: Fujitsu Launches Ultrafast 56GSa/s 8-Bit ADC Technology for 100G Coherent Receivers and High-Performance Test Equipment
Langen, Germany, January 27, 2009 – Fujitsu Launches Ultrafast 56GSa/s 8-Bit ADC Technology for 100G Coherent Receivers and High-Performance Test Equipment
26 January 2009 USA: Fujitsu Adds Smaller, Lower-Cost Thermal Printer Interface Board
Sunnyvale, CA, January 26, 2009 – Fujitsu Components America, Inc. today added a new high-performance, “mini” interface board series for its 24-volt, FTP-609 series of 2, 3 and 4-inch thermal printer mechanisms. The new boards are 40% smaller and cost 20% less than the existing FTP-629DSL100 interface board series. When integrated with a Fujitsu print mechanism, they provide designers with a high-quality, cost-effective, space-saving printing solution for POS, kiosk, ticketing, labeling, banking, instrumentation and medical equipment applications.
26 January 2009 Germany and Austria: Fujitsu Acquires Embedded Software Development Centre in Linz, Austria
Langen, Germany and Linz, Austria, January 26, 2009 – Fujitsu Acquires Embedded Software Development Centre in Linz, Austria
23 January 2009 The Netherlands: FUJITSU - How To Change The Conventional Way Of Public Transport
Hoofddorp, January 23, 2009 – With space as an all time compromise in mobile and transport applications Fujitsu has developed the FTP-608 thermal printer.
22 January 2009 The Netherlands: Fujitsu FTR-B3-RF - High Frequency Relay
Hoofddorp, January 22, 2009 – Fujitsu Components Europe B.V., releases the FTR-B3-RF relay, the ultra miniature high frequency relay.
9 January 2009 The Netherlands: FUJITSU –FTP-628 Taxiing To Solutions
Hoofddorp, January 9, 2009 – With the FTP-628 thermal printer Fujitsu has had the opportunity to provide solutions in a wide range of transportation applications.

Top of Page