High Speed "microGiGaCN™ I/O and board-to-board stacking connectors, high reliability DDR3, DDR4 DIMM and PCIe card edge sockets.
New grounding springs expand choices for mobile devices
The FCN-118X grounding spring series comes in free heights as low as 1.8mm and up to 2.5mm, and in working ranges of 0.85mm to 2.4mm for mobile designs.
Datasheet | Press Release
DDR4 DIMM sockets feature a highly reliable contact structure
Split-beam contact construction greatly reduces intermittent signals and improves intermateability between memory card and pcb socket.
Recent Connectors Press Releases
January 21, 2014
Fujitsu Introduces Grounding Springs for Mobile Devices
Fujitsu Components Asia Pte. Ltd. today released a new series of grounding springs featuring a patented, robust structure and a wide working range for use in emerging mobile devices.
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