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Packaging Stress Analysis
Analyses that leverage our expertise in substrate manufacturing as well as Fujitsu Group’s experience in electronics manufacturing.
The heat generated at the time of component packaging causes substrate warpage and gives stress on the component joints, decreasing packaging yield and product reliability. Analyzing such problems in packaging in a way consistent with customer's point of view, we propose optimal packaging design by suggesting packaging location and stress improvement countermeasure best suited to each customer.
Performing simulations in the early stages of the development phase will greatly reduce the number of verifications for prototypes, resulting in the reduction of cost and time during the development process.
Fully utilize the extensive experience and performance of our company and Fujitsu Group combined
Provide non-linear analysis and coupled analysis that take into account the temperature dependency of various material physical property value
Accommodate highly precise analysis, providing large-scale analysis by mesh refinement
Perform qualitative and quantitative verifications based on visualization and quantification of stress/strain distributions
Perform highly precise life prediction by matching simulation and actual devices
Perform modeling in collaboration with a variety of 3D tools（Pro/E, VPS, step, iges, inp, etc.）
Type of Analysis
Stress and thermal stress analysis
Warpage behavior simulation
SMT board level reliability analysis
Dynamic shock analysis
Structural strength analysis
Modeling service for simulation
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