FUJITSU Workstation CELSIUS
FUJITSU Workstation CELSIUS
Powerful tools to speed up your design and creative workflows
CELSIUS workstations from Fujitsu support creativity, simulation, calculation and visualization at the highest professional level.
With end-to-end capabilities from design and engineering to production, CELSIUS workstations have gained a great reputation for offering ingenious thermal management and cooling as well as reaching world-leading benchmarks. All mobile, desktop and rack workstations are optimized for use with a host of leading applications such as Autodesk, Dassault Systèmes, Siemens PLM or PTC.
Outstanding Performance

Maximum Reliability

Unrivalled Expandability

Enterprise-Grade Security

Virtual Reality Software Development
“I needed a computer that was able to keep up with me; I do a lot of simulations and modeling and I need to run them all in real time. With FUJITSU CELSIUS Workstations, we have got a deal - I do the high-level thinking and it does the math."
- Juraj Hudák, VR designer

Find the right workstation
Operating System
Processor
Graphics
Mass storage
Memory
Type
PCIe slots
Certificates
FUJITSU Workstation CELSIUS H7510 | FUJITSU Workstation CELSIUS C780 | Station de travail FUJITSU CELSIUS R970 | |
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Operating system |
Windows 10 Pro Windows 10 Pro for Workstations Windows 10 Pro High End |
Windows 10 Pro for Workstations Windows 10 Pro |
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Chipset | Intel® QM480 or WM490 (depending on CPU) | Intel® C246 | Intel® C624 |
Processor | Intel® Core i5-10400H processor, 2.60 GHz, up to 4.6 GHzIntel® Core i7-10875H processor, 2.30 GHz, up to 5.1 GHzIntel® Core i7-10850H processor, 2.70 GHz, up to 5.1 GHzIntel® Core i9-10885H processor, 2.40 GHz, up to 5.3 GHzIntel® Xeon® processor W-10885M, 2.4 GHz, up to 5.3 GHzIntel® Xeon® processor W-10855M, 2.80 GHz, up to 5.1 GHz | Intel® Xeon® processor E-2224G, 8 MB, 3.50 GHz, up to 4.7 GHzIntel® Xeon® processor E-2224, 8 MB, 3.40 GHz, up to 4.6 GHzIntel® Xeon® processor E-2234, 8 MB, 3.60 GHz, up to 4.8 GHzIntel® Xeon® processor E-2236, 12 MB, 3.40 GHz, up to 4.8 GHzIntel® Xeon® processor E-2244G, 8 MB, 3.80 GHz, up to 4.8 GHzIntel® Xeon® processor E-2246G, 12 MB, 3.60 GHz, up to 4.8 GHzIntel® Xeon® processor E-2274G, 8 MB, 4.00 GHz, up to 4.9 GHzIntel® Xeon® processor E-2276G, 12 MB, 3.80 GHz, up to 4.9 GHzIntel® Xeon® processor E-2278G, 16 MB, 3.40 GHz, up to 5.0 GHzIntel® Xeon® processor E-2286G, 12 MB, 4.00 GHz, up to 4.9 GHzIntel® Xeon® processor E-2288G, 16 MB, 3.70 GHz, up to 5.0 GHzIntel® Core i9-9900 processor, 16 GB, 3.10 GHz, up to 5.0 GHzIntel® Core i9-9900K processor, 16 GB, 3.60 GHz, up to 5.0 GHzIntel® Core i7-9700K processor, 12 MB, 3.60 GHz, up to 4.9 GHzIntel® Core i5-9500 processor, 9 MB, 3.00 GHz, up to 4.4 GHzIntel® Core i3-9100 processor, 6 MB, 3.60 GHz, up to 4.2 GHz | - |
Supported capacity RAM (max.) | 128 GB, 4 Memory slot(s) SO DIMMBased on Intel® design, systems built with four DIMM slots run at 2400 MT/s. | 128 GB, 4 Memory slot(s) DIMM (DDR4) ECC/non-ECC, Dual channel support, For dual channel performance, 2 memory modules have to be ordered. Capacity per channel has to be the same. 2666 MHz may be clocked down to 2400 MHz depending on processor and memory configuration | - |
Hard disk drive | HDD SATA III, 5,400 rpm, 1000 GBPCIe-SSD, NVMe, 1024 GB Highend, M.2 modulePCIe-SSD, NVMe, 2048 GB Highend, M.2 modulePCIe-SSD, NVMe, 256 GB Highend, M.2 moduleHDD SATA III, 5,400 rpm, 500 GBSSD SATA III, 512 GB, M.2 module, SEDPCIe-SSD, NVMe, 512 GB Highend, M.2 modulePCIe-SSD, NVMe, 512 GB Highend, M.2 module, SED | - | - |
Interfaces | 1x x DC-in1 x Audio: line-in / line-out2x digital array microphones x Internal microphones1x (type A) power off charge x USB 3.1 Gen1 (USB 3.0) total2 x USB Type-C1x x VGA1 x HDMI1× x Ethernet (RJ-45)1x x SmartCard slot1 x SIM card slot | 2 x USB 2.0 total2x 2.0 x USB front1x 3.0 x USB internal3x 3.0 x USB rear1 x Serial (RS-232, optional via slot bracket)1 (IRMC) x VGA2 x Ethernet (RJ-45) | 1 x Audio : entrée (arrière)1 x Audio : sortie (arrière)1 x Audio : entrée1 x Audio : sortie1 x Haut-parleurs internes9 x Total USB 2.02 ports USB 2.0 ; 2 ports USB 3.1 (Gen1) ; en option : 1 port USB 3.1 Type C (Gen2) via une carte complémentaire et un adaptateur en façade pour baie x USB en façade3, dont 1 de type A x USB interne6 x USB à l'arrière2 x Ethernet (RJ-45)1 (en option) x eSATA |
Display | 39.6 cm (15.6-inch), LED backlit, (Full HD), Anti-glare IPS display, 700 typ., 400 cd/m² | - | - |
Graphics brand name | NVIDIA® Quadro RTX 3000NVIDIA® Quadro® T2000NVIDIA® Quadro® T1000NVIDIA® Quadro® P620 | - | - |
Camera | Built-in webcam (Full HD) with Status LED | - | - |
Weight | from 2.7 kg - Actual weight may vary depending on configurationfrom 5.95 lbs | approx. 13 kgapprox. 28.7 lbs | - |
Dimensions (W x D x H) | 380.0 x 258.0 x 31.9 mm14.96 x 10.16 x 1.26 inch | - | - |
Runtime battery | up to 12 hours (depending on configuration) | - | - |
Audio codec | Realtek ALC255 with MaxxAudio | - | - |
Audio features | Stereo speakers, 2 digital microphones | - | - |
3G/4G (optional) | Sierra Wireless EM7421 (Cat. 7) | - | - |
LAN | 10/100/1,000 MBit/s Intel® I219LM | - | - |
Warranty | 3 years (depending on country) | - | - |
Graphics features | - | Ultra-high-end 3D: NVIDIA® Quadro® GV100, 32 GB, PCIe x16, 4 x DisplayPortUltra-high-end 3D: NVIDIA® Quadro® RTX 8000, 48 GB, PCIe x16, 4 x DisplayPort, 1 x Virtual LinkUltra-high-end 3D: NVIDIA® Quadro® RTX 6000, 24 GB, PCIe x16, 4 x DisplayPort, 1 x Virtual LinkUltra-high-end 3D: NVIDIA® Quadro® P6000, 24 GB, PCIe x16, 1 x Dual Link DVI-D, 4 x DisplayPortUltra-high-end 3D: NVIDIA® Quadro® RTX 5000, 16 GB, PCIe x16, 4 x DisplayPort, 1 x Virtual LinkHigh-end 3D: NVIDIA® Quadro® RTX 4000, 8 GB, PCIe x16, 3 x DisplayPort, 1 x Virtual LinkHigh-end 3D: NVIDIA® Quadro® P4000, 8 GB, PCIe x16, 4 x DisplayPortMidrange 3D: NVIDIA® Quadro® P2200, 5 GB, PCIe x16, 4 x DisplayPortEntry 3D: NVIDIA® T1000, 4 GB, PCIe x16, 4 x miniDPEntry 3D: NVIDIA® Quadro® P1000, 4 GB, PCIe x16, 4 x miniDPEntry 3D: AMD Radeon Pro WX 2100, 2 GB, 320 stream processors, PCIe x16, 1 x DisplayPort, 2 x miniDPEntry 3D: NVIDIA® T600, 4 GB, PCIe x16, 4 x miniDPEntry 3D: NVIDIA® Quadro® P620, 2 GB, PCIe x16, 4 x miniDPEntry 3D: NVIDIA® T400, 2 GB, PCIe x16, 3 x miniDPEntry 3D: NVIDIA® Quadro® P400 , 2 GB, PCIe x16, 3 x miniDPRemote Graphics: CELSIUS RemoteAccess Dual Card, PCIe x1, 2 x miniDP, PCoIPRemote Graphics: CELSIUS RemoteAccess Quad Card, PCIe x1, 4 x miniDP, PCoIPOthers: DP to DVI-D (single link) Adapter CableOthers: MiniDP to DP Adapter Cable | - |
Produit | - | - | CELSIUS R970 |
Système d'exploitation | - | - | Windows 10 Pro for Workstations |
Processeur | - | - | Processeur Intel® Xeon® Silver 4215R, 3.20 GHz, jusqu'à 4,0 GHzProcesseur Intel® Xeon® Silver 4214R, 2.40 GHz, jusqu'à 3,5 GHzProcesseur Intel® Xeon® Silver 4210R, 2.40 GHz, jusqu'à 3,2 GHzProcesseur Intel® Xeon® Silver 4208, 2.10 GHz, jusqu'à 3,2 GHzProcesseur Intel® Xeon® Platinum 8276, 2.20 GHz, jusqu'à 4,0 GHzProcesseur Intel® Xeon® Gold 6244, 3.60 GHz, jusqu'à 4,4 GHzProcesseur Intel® Xeon® Gold 6240R, 2.40 GHz, jusqu'à 4,0 GHzProcesseur Intel® Xeon® Gold 6240, 2.60 GHz, jusqu'à 3,9 GHzProcesseur Intel® Xeon® Gold 6226R, 2.90 GHz, jusqu'à 3,9 GHzProcesseur Intel® Xeon® Gold 5222, 3.80 GHz, jusqu'à 3,7 GHzProcesseur Intel® Xeon® Gold 5220R, 2.20 GHz, jusqu'à 4,0 GHzProcesseur Intel® Xeon® Gold 5220, 2.20 GHz, jusqu'à 3,9 GHzProcesseur Intel® Xeon® Gold 5218R, 2.10 GHz, jusqu'à 4,0 GHzProcesseur Intel® Xeon® Gold 5217, 3.00 GHz, jusqu'à 3,7 GHz |
Capacité maximale de mémoire RAM prise en charge | - | - |
1024 Go, 16 Emplacement(s) mémoire DIMM (DDR4) ECC, 6 canaux de mémoire, dont 2 canaux prenant en charge 2 DIMM par canal, Pour des performances optimales sur les 6 canaux, un minimum de 6 modules de mémoire doivent être commandés et la capacité par canal doit être la même, La mémoire DDR4 de 2 666 MHz peut être ralentie à 2 400 ou 2 133 selon le processeur,, Prise en charge jusqu'à 1 To de mémoire principale (disponible sur demande), Cela nécessite l'utilisation du processeur double avec certains processeurs et modules de mémoire DDR4 de 128 Go,1024 Go, 16 Emplacement(s) mémoire DIMM (DDR4) ECC, 6 canaux de mémoire, dont 2 canaux prenant en charge 2 DIMM par canal, Pour des performances optimales sur les 6 canaux, un minimum de 6 modules de mémoire doivent être commandés et la capacité par canal doit être la même, La mémoire DDR4 de 2 933MHz peut être ralentie à 2 666, 2 400 ou 2 133 selon le processeur,, Prise en charge jusqu'à 2 To de mémoire principale (disponible sur demande), Cela nécessite l'utilisation du processeur double avec certains processeurs et modules de mémoire DDR4 de 128 Go, |
Fonctionnalités de la carte graphique | - | - | Ultra-high-end 3D: NVIDIA® Quadro® GV100, 32 Go, PCIe x16, 4 x DisplayPortUltra-high-end 3D: NVIDIA® Quadro® RTX 8000, 48 Go, PCIe x16, 4 x DisplayPort, 1 x Virtual LinkUltra-high-end 3D: NVIDIA® Quadro® RTX 6000, 24 Go, PCIe x16, 4 x DisplayPort, 1 x Virtual LinkUltra-high-end 3D: NVIDIA® Quadro® RTX 5000, 16 Go, PCIe x16, 4 x DisplayPort, 1 x Virtual LinkHigh-end 3D: NVIDIA® Quadro® RTX 4000, 8 Go, PCIe x16, 3 x DisplayPort, 1 x Virtual LinkMidrange 3D: NVIDIA® Quadro® P2200, 5 Go, PCIe x16, 4 x DisplayPortEntry 3D: NVIDIA® T1000, 4 Go, PCIe x16, 4 x miniDPEntry 3D: NVIDIA® Quadro® P1000, 4 Go, PCIe x16, 4 x miniDPEntry 3D: AMD Radeon Pro WX 2100, 2 Go, 320 processeurs de flux, PCIe x16, 1 x DisplayPort, 2 x miniDPEntry 3D: NVIDIA® T600, 4 Go, PCIe x16, 4 x miniDPEntry 3D: NVIDIA® Quadro® P620, 2 Go, PCIe x16, 4 x miniDPEntry 3D: NVIDIA® T400, 2 Go, PCIe x16, 3 x miniDPEntry 3D: NVIDIA® Quadro® P400 , 2 Go, PCIe x16, 3 x miniDPRemote Graphics: Double carte CELSIUS RemoteAccess, PCIe x1, 2 x miniDP, PCoIPRemote Graphics: Quadruple carte CELSIUS RemoteAccess, PCIe x1, 4 x miniDP, PCoIPOthers: Câble d'adaptation DP à DVI-D (liaison unique)Others: Câble d'adaptation MiniDP à DP |
Codec audio | - | - | Realtek ALC671 |
Poids | - | - | environ 20 kgenviron 44,8 lbs |
FUJITSU CELSIUS Workstation stories
Extraordinary Performance
Extremely Reliable
Highly Expandable
Faster, Efficient
Resources
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Technical Insights on AEC Vertical - Develop3D report sponsored by FUJITSU & NVIDIA
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Technical Insights on Product Development & Manufacturing - Develop3D report sponsored by FUJITSU & NVIDIA
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Freeform Dynamics Executive Brief | Advantage: Rack Workstation -- Where remote access to a rackable workstation makes sense
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CELSIUS J5010 & W5010 infographics
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Why Workstations? (eBook)
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Virtual Reality (eBook)
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Technical Report - Mixed Reality for Professionals