solder bumps
A protruding electrode on the surface of a semiconductor chip, formed through an evaporation method, plating method, or printing method.
 chip bonding
An interconnection technique whereby a chip with bumps is flipped over and attached onto a board (or in the case of a chip-on-chip MCM, onto another chip).
 Fujitsu Achieves Breakthrough in Ultrafine-Pitch Solder Bumping
A common method for forming solder bumps. A seed layer is applied employing a sputtering method, photo-resist is coated on, and then openings are created only in the bump area through a photolithographic process. The wafer is then dipped in plating solution, and the solder is deposited (see figure).
 Value Added Technologies
Headquarters: 7511 Seokwoori Dongtanmyun Hwaseongsi Kyunggido 445-811 South Korea President & CEO: Chang Joon Ro. Specialized developer and producer of X-ray imaging systems for medical and dental application, and TFT-LCD test systems, founded in 1992.
 stud bumps
Chiefly used in System-in-Package (SiP) applications. Gold balls are made of gold wire and formed into bumps using cutting techniques. Only applied on the peripheral configuration of a chip pad.
 plating methodgold bumps,
Chiefly used in chips for LCDs, or in TAB (tape-automated bonding) - BGA. Bumps are formed by gold plating. Only applied on the peripheral configuration of a chip pad.
 chip-on-chip Multi-Chip Module
Of the various multi-chip modules in which several chips are combined within one package, a module in which the upper "daughter" chip is flip-chip mounted on the lower "mother" chip.
Fujitsu Computer Products of America, Inc. (FCPA) conducts engineering and marketing activities in San Jose, CA and sales operations throughout the United States. FCPA's current product and service offerings include hard disk drives, tape drives, magneto-optical drives, scanners and scanner maintenance. FCPA is located at 2904 Orchard Parkway, San Jose, CA, 95134. For more information about Fujitsu products and services, call us at 800-626-4686 or 408-432-6333.
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Fujitsu is a leading provider of customer-focused IT and communications solutions for the global marketplace. Pace-setting technologies, highly reliable computing and telecommunications platforms, and a worldwide corps of systems and services experts uniquely position Fujitsu to deliver comprehensive solutions that open up infinite possibilities for its customers' success. Headquartered in Tokyo, Fujitsu Limited (TSE:6702) reported consolidated revenues of 4.6 trillion yen (US$38 billion) for the fiscal year ended March 31, 2003.
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Date: 15 December, 2003
Company: Fujitsu Limited, , , , ,
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