Reflow soldering
A method for attaching components to a circuit board by printing solder paste (produced by adding flux to powdered solder until it reaches the desired thickness) onto the circuit board, positioning the components on top, and then subjecting the assembly to heat in order to melt the solder. The heating equipment used is called a reflow oven. It is essential to precisely control the temperature inside the reflow oven so that it is high enough to melt the solder, but not too high that it damages the components.
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This press release has been revised as of December 17, 2018.
Date: 19 July, 2011
City: Tokyo and Nagano
Company: Fujitsu Limited, Fujitsu Nagano Systems Engineering Limited, , , , , , , , ,