A layered insulating material having a low specific dielectric constant. Effective for reducing capacitance within interconnect layers, the leading-edge technology is used to realize ultra high-speed operation and low power consumption.
 Design methodology
Method for designing leading-edge large-scale integrated circuits (LSIs) within a short period of time.
 First-shot full operation
Design methodology for advanced LSIs which enables full functionality from initial trial chips.
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Date: 11 January, 2006
Company: Fujitsu Limited, , , , ,
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