Sequential Lamination Method
A manufacturing method for PCBs in which materials for which wiring patterns have been formed in advance are integrated in a single lamination process, and the layers are connected by a mechanical drill by using ordinary plated Through Via Hole processing.
 Build-up Method
A method that enables intricate wiring, by alternately forming dielectric layers and wiring layers on the PCB that functions as the main PCB.
 Via Holes
In multi-layer wiring, the connecting sections between layers.
 effective material parameters
A physical value unique to each material, such as dielectric constant or dielectric loss, that is necessary for simulation.
 electromagnetic field analysis
A method for analyzing various transmission characteristics, through numeric simulation of electromagnetic field-strength distribution within 3-dimensional wiring.
 BGA (Ball Grid Array)
One type of mounting methods available in which the IC package and PCB are connected through high-density mounting. Hemispherical input and output terminals are laid in grids on the IC package and then mounted to the PCB.
Founded in 1968 as wholly owned subsidiary of Fujitsu Limited, Fujitsu Laboratories Limited is one of the premier research centers in the world. With a global network of laboratories in Japan, China, the United States and Europe, the organization conducts a wide range of basic and applied research in the areas of Multimedia, Personal Systems, Networks, Peripherals, Advanced Materials and Electronic Devices. For additional information, please see:
For more information, please see: www.labs.fujitsu.com/en/
Fujitsu Interconnect Technologies Limited (FICT), a technology leader in PCB design and manufacturing innovation, is a wholly owned subsidiary of Fujitsu Limited of Japan. FICT's U.S. operations, located in the Silicon Valley, provide innovative design and manufacturing solutions for package substrates and printed circuit boards to meet the needs of its global customer base. FICT's solutions enable its customers to migrate to newer, complex designs, while reducing manufacturing time and total cost.
FICT offers manufacturing services for market segments including computing PCBs such as PCs, servers and media devices; networking PCBs such as switches, routers and storage; module PCBs such as miniature camera applications; consumer PCBs such as cell phones, PDAs, video games; and industrial PCBs such as automotive, medical. FICT also offers design, design review, design enhancement, layer reduction, testing and evaluation services for PCBs from four to 54 layers.
For more information, please see: us.fujitsu.com/fbf/fict/home
Fujitsu is a leading provider of customer-focused IT and communications solutions for the global marketplace. Pace-setting technologies, highly reliable computing and telecommunications platforms, and a worldwide corps of systems and services experts uniquely position Fujitsu to deliver comprehensive solutions that open up infinite possibilities for its customers' success. Headquartered in Tokyo, Fujitsu Limited (TSE:6702) reported consolidated revenues of 4.6 trillion yen (US$38 billion) for the fiscal year ended March 31, 2003.
For more information, please see: www.fujitsu.com
Company:Fujitsu Interconnect Technologies Ltd.
Technical ContactsMaterials and Environmental Engineering Lab.
Company:Fujitsu Laboratories Ltd.
Technical ContactsCorporate Technology Engineering Center
Date: 09 March, 2004
Company: Fujitsu Laboratories Ltd., Fujitsu Interconnect Technologies Limited, Fujitsu Limited, , ,
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