We propose high-density and high-reliability multilayer PCBs for large pin-count BGA, placement on both sides of PCBs, applying technologies of conventional and sequential lamination. Our extended IVH technology enables to apply sequential lamination technology even for large PCBs over 500mm size.
Note: *1) High density PCB fabrication technology for hybrid layer structure composed of HDI technology and sequential lamination process.
F-ALCS technology, which uses no plating process for vias forming, maximizes wiring capacity with its any layer IVH structure. This technology also enables to shorten fabrication lead-time with its one-time lamination process.
We propose best solutions for customer needs for high-density PCBs with huge wiring capacity like organic Probe Card applications.
Narrow pitch PTH VIAs are available for high-density LSI testing boards and 0.4mm / 0.5mm pitch BGA burn-in boards. Moreover, high density PTH placements are available with our high-aspect PTH plating technology. General specifications about PCB thickness and their related PTH Via diameter are listed as below.
We propose for customer needs beyond general specifications. Please contact our sales for further requirements.
|Line/Space||0.05mm/0.05mm-0.09mm/0.09mm (depends on Cu thickness)|
*MAX SPEC : Size 810mm×660mm, Thickness 8.0mm, Layer counts 52 layers
We can solve the problem with total PCB solutions!
|Layer Construction||50 layers (with inner IVH layers)|
|PCB Size, Thickness||568mm × 470mm, 7.3mm|
|L/S, Via diameter||90µm / 110µm, φ350µm|
|Layer Construction||8 layers (for DIP type sockets)|
|PCB Size, Thickness||480mm × 580mm, 1.6mm|
|Via diameter (PTH)||Φ150µm|
More details for PCB specifications and application cases
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