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Fujitsu Launches the World’s First Low-Power Memory with 125 Degree C Specification for System-in-Package Products

High temperature resistance solves thermal and cost issues in consumer electronics products

Fujitsu Semiconductor America Inc.

Sunnyvale, CA, May 19, 2009 fcram

Fujitsu Microelectronics America, Inc. (FMA) today introduced two consumer FCRAM memory ICs with the world’s first operating temperature range extended to 125ºC with DDR SDRAM interfaces. The new, low-power memory ICs are optimized for use in System-in-Packages (SiP) in consumer products such as digital TVs and digital video cameras. Samples of the Fujitsu 512Mbit MB81EDS516545 and 256Mbit MB81EDS256545 FCRAMs are available now.

“Customers using the new FCRAM ICs combined with a System-on-Chip (SoC) in the SiP configuration will achieve optimal performance even as the temperature of the SiP rises with the increase in operating speed,” said Tong Swan Pang, senior marketing manager, Fujitsu Microelectronics. “Today’s digital consumer products continue to demand higher performance, higher speeds and lower costs. SiPs that combine a memory chip with the SoC meet these requirements, and reduce the number of components and board space, helping lower system costs. Where rapid and flexible design is a key factor for success in the consumer electronics market, SiPs integrate high-speed memory and simplify design,” he added.

Conventional memory has limited SiP usage because power consumption drives up temperatures. For example, a high-performance SoC can operate up to a maximum of 125°C, but the SiP becomes inoperable at much lower temperatures because memory has a lower temperature tolerance. One way to make SiPs viable with conventional memory is to add a heat disperser such as a heat sink to reduce temperatures to within operational range. But this solution increases both cost and footprint.

The Fujitsu 512Mbit and 256Mbit consumer FCRAM ICs feature a maximum operating temperature of 125°C. Using the new FCRAMs, the SiP operates to specification even when it is used with a SoC featuring high power consumption – with no need to add a heat sink. (See Illustration of SiP with conventional memory compared with the SiP with a 125°C-rated FCRAM,

The new FCRAMs also can provide data-transfer rates more than twice the rate of the conventional DDR SDRAM memory, while keeping power consumption low. The 512Mbit FCRAM can reduce power consumption by up to 50 percent compared to the equivalent conventional DDR2 SDRAM memory. As result, these FCRAMs contribute to a 50 percent reduction of CO2 emissions that typically emanate from the memory in digital consumer products.

Fujitsu Microelectronics will continue to develop products with the necessary performance and functionality for SiPs to provide solutions with optimal value and cost for digital consumer products.

Pricing and Availability

Samples of the 512Mbit MB81EDS516545 and 256Mbit MB81EDS256545 are available now. Pricing is available upon request.

Key Product Features

1. World’s first operation up to 125°C
These new FCRAMs have a maximum operating temperature of 125ºC, greatly increasing the allowable power consumption within the system. Previous SiP solutions were characterized by overheating due to the combination of SoCs with high power and memory requirements. Also, the new FCRAMs allow the use of low-cost packaging that doesn’t need high-temperature specifications.

2. Low-power consumption
The bus width has been expanded to 64 bits and the operating frequency has been reduced compared to previous products. Also, there is no need for terminating resistors, which are attached at the termination of a circuit wiring or a signal to prevent interference due to signal reflection. As a result, the power consumption of these new FCRAMs can be cut up to half compared with the equivalent system of two conventional DDR2 SDRAM memory ICs with 16-bit bus width. The new FCRAM also helps reduce memory-induced CO2 emissions from consumer products by about 50 percent.

3. High-data bandwidth
For operating temperatures of 125°C, by having a 64bit bus width and a maximum operating frequency of 200MHz, these new FCRAMs can provide a data transfer rate of 3.2Gbyte/second. That is two times the data rate of conventional DDR2 SDRAM memory. For operating temperatures of 105°C and below, with an operating frequency of 216MHz, the data transfer rate increases to 3.46Gbyte/second.

Key Specifications of the 512Mbit FCRAM, MB81EDS516545

512Mbit FCRAM, MB81EDS516545

Key Specifications of the 256Mbit FCRAM, MB81EDS256545

256Mbit FCRAM, MB81EDS256545

About Fujitsu Microelectronics America, Inc.

Fujitsu Microelectronics America, Inc. (FMA) leads the industry in innovation. FMA provides high-quality, reliable semiconductor products and services for the automotive, wireless, industrial, consumer, and other markets throughout North and South America. As a founding member and current board member of the WiMAX Forum™, Fujitsu supports the standards development and compliance programs that are essential to successful Broadband Wireless deployment. Fujitsu provides performance-driven WiMAX solutions by leveraging the company's experience and expertise in the networking and communications markets. Fujitsu offers flexible WiMAX SoC and reference designs for WiMAX-certifiable systems to equipment vendors. For more product information, please visit the company's web site at or address e-mail to

Press Contact - FMA

Emi Igarashi

Phone: Phone: 408-737-5647
E-mail: E-mail:
Company:Fujitsu Microelectronics America, Inc.

All product names mentioned herein are trademarks or registered trademarks of their respective owners.

Date: May 19, 2009
City: Sunnyvale, CA
Company: Fujitsu Microelectronics America, Inc., ,