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  6. Fujitsu to Feature Success at 65-Nanometer Process Technology at Fabless Semiconductor Association Forum June 14

Fujitsu to Feature Success at 65-Nanometer Process Technology at Fabless Semiconductor Association Forum June 14

“Fujitsu at 65nm” Presentation to Focus on Challenges of Deep Submicron Process

Fujitsu Semiconductor America Inc.

Sunnyvale, CA, June 13, 2006

Fujitsu Microelectronics America, Inc. (FMA) will deliver a comprehensive review of its 65-nanometer technology, featuring the company’s fully integrated design solution, at the 2006 FSA Semiconductor Forum, June 14, at the Santa Clara Convention Center.

The presentation, entitled “Fujitsu @ 65nm – Providing Solutions through Integrated Design Services,” will be made by Paul Little, FMA’s senior manager of Methodology Development, Advanced Technology Research and Information Center. The presentation is scheduled from 2:55 p.m. to 3:40 p.m. in Room 204.

Little will discuss the benefits of 65nm process technology, including:

  • The 50 percent reductions in die size and reduction of overall system cost,
  • The 30 percent reduction in power requirements and significant performance improvements,
  • The benefits of low-k dielectric in delivering high speed and low power dissipation, and
  • The importance of performing noise analysis simultaneously on the IC and the printed circuit board.

Little also will detail Fujitsu’s experience in coordinating design flow between design and manufacturing groups, and in yield analysis and management, and explain how the company overcomes these challenges at deep submicron process levels. He will focus on noise analysis and how Fujitsu’s design process increases verification coverage of the final product, reducing the likelihood of design re-spins. He will also include an update on Fujitsu’s IP development and support offerings, which are integral parts of the company’s total solution.

“Fujitsu brings decades of experience with the most advanced processes and technologies to deliver complete solutions for 65-nanometer product development,” said Jason So, senior director for ASIC and Foundry Services at Fujitsu Microelectronics. “We integrate design flow with a comprehensive IP portfolio and industry-leading design services, from tool support all the way to test engineering, enabling our customers to develop innovative, low-power, cost-efficient ICs using leading-edge process technology.”

About Fujitsu Microelectronics America, Inc.

Fujitsu Microelectronics America, Inc. (FMA) leads the industry in innovation. FMA provides high-quality, reliable semiconductor products and services for the networking, communications, automotive, security and other markets throughout North and South America. As a founding and board member of the WiMAX Forum™, Fujitsu supports the standards development and compliance programs that are essential to successful Broadband Wireless deployment. Fujitsu provides performance-driven WiMAX solutions by leveraging the company's experience and expertise in the networking and communications markets. Fujitsu offers flexible WiMAX SoC and reference designs for WiMAX-certifiable systems to equipment vendors. For more product information, please visit the company's web site at http://us.fujitsu.com/micro/WiMAX or please address e-mail to inquiry.bwa@fma.fujitsu.com

Press Contact - FMA

Emi Igarashi

Phone: Phone: 408-737-5647
E-mail: E-mail: eigarash@fma.fujitsu.com
Company:Fujitsu Microelectronics America, Inc.

Date: June 13, 2006
City: Sunnyvale, CA
Company: Fujitsu Microelectronics America, Inc.