GTM-TJ3R99R
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Rigid Capabilities

Standard
mm
Advanced
mm
Board maximum possible size 900*600mm 1041*610mm
Maximum Finished PCB Thickness 8mm 10mm
Board Thickness Tolerance +/-10% +/-8%
First run
Duplicates
Warpage (%)
(flatness of finished board overall)
0.75% 0.50%
Dimensions - Mechanical Hole Location Tolerance 0.15mm 0.1mm
Direct Imaging
CAPABILITIES
Traces (µm) (µm)
Minimum Line Width & Thickness 76 76
Minimum Trace to Trace Space 76 76
Minimum Trace to Hole Space/Thickness : 76 76
plated hole 150 100
non plated hole 150 100
Minimum Trace to Pad Space/Thickness 170 170
Maximum Aspect Ratio 8:1 10:1
Laser Drilling 76 76
PADS
Minimum Plated Hole Size * (Finished) 200 200
Tolerance - Plated Hole Size 10% 10%
Tolerance pad to hole alignment 250 250
Minimum Layer Pad
Inner 170 170
Outer 180 180
Tolerance Layer Pad
Inner 10% 10%
Outer 10% 10%
Mech. Min. Drill Hole Size 150 100
Min. Non-Plated Hole to Metal
Inner 200 150
Outer 200 150
In pad via filling technology Resin plugging
Plated pad planarity Y
Maximum pad overetch
SMT Minimum Pad Spacing 76 76
Line to SMT Minimum Space 150 140
ELECTRICAL CHARACTERISTICS
Impedance Tolerance 10% 8%

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