Worldwide
Rigid Capabilities
| Standard
mm |
Advanced
mm |
|
| Board maximum possible size | 900*600mm | 1041*610mm |
| Maximum Finished PCB Thickness | 8mm | 10mm |
| Board Thickness Tolerance | +/-10% | +/-8% |
| First run | ||
| Duplicates | ||
| Warpage (%)
(flatness of finished board overall) |
0.75% | 0.50% |
| Dimensions - Mechanical Hole Location Tolerance | 0.15mm | 0.1mm |
| Direct Imaging | ||
| CAPABILITIES | ||
| Traces | (µm) | (µm) |
| Minimum Line Width & Thickness | 76 | 76 |
| Minimum Trace to Trace Space | 76 | 76 |
| Minimum Trace to Hole Space/Thickness : | 76 | 76 |
| plated hole | 150 | 100 |
| non plated hole | 150 | 100 |
| Minimum Trace to Pad Space/Thickness | 170 | 170 |
| Maximum Aspect Ratio | 8:1 | 10:1 |
| Laser Drilling | 76 | 76 |
| PADS | ||
| Minimum Plated Hole Size * (Finished) | 200 | 200 |
| Tolerance - Plated Hole Size | 10% | 10% |
| Tolerance pad to hole alignment | 250 | 250 |
| Minimum Layer Pad | ||
| Inner | 170 | 170 |
| Outer | 180 | 180 |
| Tolerance Layer Pad | ||
| Inner | 10% | 10% |
| Outer | 10% | 10% |
| Mech. Min. Drill Hole Size | 150 | 100 |
| Min. Non-Plated Hole to Metal | ||
| Inner | 200 | 150 |
| Outer | 200 | 150 |
| In pad via filling technology | Resin plugging | |
| Plated pad planarity | Y | |
| Maximum pad overetch | ||
| SMT Minimum Pad Spacing | 76 | 76 |
| Line to SMT Minimum Space | 150 | 140 |
| ELECTRICAL CHARACTERISTICS | ||
| Impedance Tolerance | 10% | 8% |