Rigid Capabilities
Standard
mm |
Advanced
mm |
|
Board maximum possible size | 900*600mm | 1041*610mm |
Maximum Finished PCB Thickness | 8mm | 10mm |
Board Thickness Tolerance | +/-10% | +/-8% |
First run | ||
Duplicates | ||
Warpage (%)
(flatness of finished board overall) |
0.75% | 0.50% |
Dimensions - Mechanical Hole Location Tolerance | 0.15mm | 0.1mm |
Direct Imaging | ||
CAPABILITIES | ||
Traces | (µm) | (µm) |
Minimum Line Width & Thickness | 76 | 76 |
Minimum Trace to Trace Space | 76 | 76 |
Minimum Trace to Hole Space/Thickness : | 76 | 76 |
plated hole | 150 | 100 |
non plated hole | 150 | 100 |
Minimum Trace to Pad Space/Thickness | 170 | 170 |
Maximum Aspect Ratio | 8:1 | 10:1 |
Laser Drilling | 76 | 76 |
PADS | ||
Minimum Plated Hole Size * (Finished) | 200 | 200 |
Tolerance - Plated Hole Size | 10% | 10% |
Tolerance pad to hole alignment | 250 | 250 |
Minimum Layer Pad | ||
Inner | 170 | 170 |
Outer | 180 | 180 |
Tolerance Layer Pad | ||
Inner | 10% | 10% |
Outer | 10% | 10% |
Mech. Min. Drill Hole Size | 150 | 100 |
Min. Non-Plated Hole to Metal | ||
Inner | 200 | 150 |
Outer | 200 | 150 |
In pad via filling technology | Resin plugging | |
Plated pad planarity | Y | |
Maximum pad overetch | ||
SMT Minimum Pad Spacing | 76 | 76 |
Line to SMT Minimum Space | 150 | 140 |
ELECTRICAL CHARACTERISTICS | ||
Impedance Tolerance | 10% | 8% |