High-density wiring structure for high-density bump interconnect.
Suitable for high frequency operation over 10GHz.
GigaModule-EC, a substrate structure with embedded TFC (Thin Film Capacitor) for semiconductor package
GigaModule-EC adopts a technology which enables decoupling capacitors to be embedded on a substrate right beneath a LSI to operate in high frequencies with low voltages. The GigaModule substrate can be used for build-up or coreless substrates.