Thermal Management AnalysisWe perform verification and evaluation for thermal structure, responding to each customer’s thermal problems for electronic devices.
By performing our thermal management analysis in the early stages of the development phase, we help our customers in reducing cost and time during the development process.
- Highly precise modeling
- Optimization of radiating fin shape
- Optimization of flow path structure and/or inlet/outlet port
- Numerical evaluation for unmeasurable fine structure
- Smooth modeling in collaboration with a variety of 3D tools（STEP, SAT, STL, iges, Pro/E etc.）
- Calculation of junction temperature by estimating temperature rise of electronic device
- Evaluation of cooling structure inside casing of electronic device
- Verifications of results represented by arbitrary cross-section distribution map and/or vector is available by visualizing flows for temperature/speed/fluid
- Temperature distribution representation
- Speed distribution representation
- Flow representation