High-end PCB and interconnect technologies



Innovative F-ALCS technology which Fujitsu Interconnect Technologies (FICT) has developed is able to meet any customer needs and requirements about printed wiring board manufacturing.

Multilayer PCBs

HDI PCBs provide a total solution including design, manufacturing and assembly for automotive, IoT modules and Omnipresent products.

Hybrid PCBs for advanced semiconductor device testing probe cards, performance boards and burn-in card PCBs.

Substrates with Ultra-Thin & High-Density wiring structure, applying core layer free, full build-up, and full stacked-via technology.

Solution Services

PCBs assembly services include Prototype Assembly, Reliability Evaluation and Failure Analysis.

Comprehensive board-design solutions across all stage of the product development from circuit design through prototype development to mass production.

Simulation & Consulting services include Electrical Simulation and Physical Simulation including Signal Integrity, Power Integrity, Thermal Management and Packaging Stress Analysis.

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