Innovative F-ALCS technology which Fujitsu Interconnect Technologies (FICT) has developed is able to meet any customer needs and requirements about printed wiring board manufacturing.
HDI PCBs provide a total solution including design, manufacturing and assembly for automotive, IoT modules and Omnipresent products.
Hybrid PCBs for advanced semiconductor device testing probe cards, performance boards and burn-in card PCBs.
Substrates with Ultra-Thin & High-Density wiring structure, applying core layer free, full build-up, and full stacked-via technology.
PCBs assembly services include Prototype Assembly, Reliability Evaluation and Failure Analysis.
Comprehensive board-design solutions across all stage of the product development from circuit design through prototype development to mass production.
Simulation & Consulting services include Electrical Simulation and Physical Simulation including Signal Integrity, Power Integrity, Thermal Management and Packaging Stress Analysis.