Products

Shinko High Density Substrate

IC Package

Shinko offers a wide variety in IC- Substrates, ranging from 2 Layer Substrates in through-hole type to high Layer count with high-density routing.

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Device Embedded Package

Packaging

Shinko undertakes IC package assembly on consignment, and use plastic laminated substrates, tape substrates and interposers to perform assembly. Package types available are BGA, CSP, and others.

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Shinko Heat Spreader

Components

Shinko's advanced packaging solutions include heat spreader, glass-to-metal seal and electrostatic chuck components.

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Upcoming Products

POL (Power Overlay)

is an advanced embedded packaging solution for power electronics.

Wireless Sensor Module

has been developed by Shinko to perform as a build-in small sensor module for IoT edge devices.

Micro Loop Heat Pipe

is a thermal solution for electronic devices.

If you would like more information about these products, don´t hesitate to contact us via our contact form or per email at info.feeu@de.fujitsu.com

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