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Talent Highland

Talent Highland logo Talent Highland logo

Company overview

  • Company name: Talent Highland Co., Ltd
  • Foundation: 2008
  • Headquarter: Zhubei City, Taiwan (ROC)
  • Products:
    • Customized System in Package (SiP) solutions including design and manufacturing
  • Company home page: www.talenthighlandtec.com

With Talent Highland as partner, Fujitsu Electronics Europe offers complete customized System in Package (SiP) solutions including design and manufacturing since 2008. Applications targeting from security for industrial and automotive as well as products for consumer and medical.

Product overview

As first product available via the Fujitsu Electronics distribution channel, Talent Highland (Taiwan Branch) developed and built the companies first openly available SiP offering Bluetooth Low Energy (BLE) functionality for instant implementation.

SiP BLE from Talent Highland is just 7x7mmThe SIP-B1 is a fully integrated BLE module based on the Dialog DA14580 BLE SoC for customer with the requirement of having BLE highly integrated.

In a 7mm x 7mm LGA package this SiP incorporates the DA14580 with integrated BLE Core, Radio Transceiver and ARM Cortex M0 16MHz and 42KB RAM as well as 1Mbit SPI FLASH, crystals, passives and antenna. With the internal DC/DC converter, the small module is supporting 3V and 1.5V batteries.

Talent Highland SiP BLE Block Diagram

Talent Highland ClickBeetle

For projects in evaluation or early development stage, Fujitsu Electronics Europe offers The SIP-B1 on the ClickBeetle™ reference platform. Interested developers can such test the functionality and performance of the BLE system with our adapted software examples and in combination with every member of the ClickBeetle™-Family. See also http://www.feeu.com/clickbeetle


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Features

  • Processing power
    • 16 MHz 32 bit ARM Cortex-M0 with SWD interface
    • Dedicated Link Layer Processor
    • AES-128 bit encryption Processor
  • Memories
    • 32 kB One-Time-Programmable (OTP) memory
    • 42 kB System SRAM
    • 84 kB ROM
    • 8 kB Retention SRAM
    • Extra 1M bits SPI Flash inside SiP
  • Power management
    • Integrated Buck/Boost DC-DC converter
    • P0, P1, P2 and P3 ports with 3.3 V tolerance
    • Easy decoupling of only 4 supply pins
    • Supports coin (typ. 3.0 V) and alkaline (typ. 1.5 V) battery cells
    • 10-bit ADC for battery voltage measurement
  • Digital controlled oscillators (16 MHz + 32 kHz)
  • General purpose, Capture and Sleep timers
  • Analog interfaces
    • 4-channel 10-bit ADC
  • Digital interfaces
    • General purpose I/Os
    • 4-channel 10-bit ADC
    • I2C bus at 100 kHz, 400 kHz
    • 3-axes capable Quadrature Decoder
  • Radio transceiver
    • Fully integrated 2.4 GHz CMOS transceiver
    • Single wire antenna: no RF matching or RX/TX switching required
    • Supply current at VBAT3V:
    • TX: 3.4 mA, RX: 3.7 mA (with ideal DC-DC)
    • 0 dBm transmit output power
    • -20 dBm output power in “Near Field Mode”
    • -93 dBm receiver sensitivity