Shinko Electric Industries Co. Ltd.
- Company name: Shinko Electric Industries Co. Ltd.
- Foundation: 1946
- Headquarter: Nagano Japan
- Products: Semiconductor Packages
- Company home page: http://www.shinko.co.jp/english/
IC Package Assembly
Shinko undertakes IC package assembly on consignment, and use plastic laminated substrates, tape substrates and interposers to perform assembly. Package types available are BGA, CSP, and others. In addition to offering ordinary wire bonding for internal connections, Shinko offers advanced package functions with flip-chip connections that support small package sizes and high speeds, depending on the requirements of the device.
Please find more information on the Shinko websites:
Standard IC Packages
System in Package (SiP), Multichip Packages (MCP), Package on Package (PoP) and Device Embedded Package [MCeP®]
Package Materials / Chip Carriers
SHINKO is developing and manufacturing a variety of lead frames, such as stamping lead frames with 256 pins; etching lead frames, suitable for quick delivery requirements; multilayered (advanced) lead frames with superior heat-dissipation properties; and leads on chips (LOC*) for memory purposes.
The heat spreader ensures safe operation of the electronic circuit by efficiently diffusing the heat released and preventing over heating of the chip.
Semiconductor Packages are almost always custom designed. Please contact us for more information.
Open Tool designs are available for Lead frames.
Based on our Quality Policy, all employees continually pursue the quality and service sought by our customer, keeping in mind our commitment to these customers’ success, which demands that we give top priority to the incorporation of quality.
ISO9001 & ISO/TS16949