GTM-TJ3R99R
Skip to main content

Mie Fujitsu Semiconductor Ltd

MIE Fujitsu logo

Company overview

  • Company name: Mie Fujitsu Semiconductor Ltd
  • Foundation: 2014
  • Headquarter: Shin-Yokohama, Kanagawa, Japan
  • Products: 300mm wafer foundry service for 90nm, 65nm, 55nm and 40nm technologies
  • Company home page: http://www.fujitsu.com/jp/group/mifs/en/Open a new window

Mie Fujitsu Semiconductor

Foundry Services


Smart Foundry for Smart Society

Mie Fujitsu Semiconductor is a foundry partner that guides customers ľ businesses towards success by providing technology, customization, and support. Through the creation of new high value-added technologies and accumulated technologies such as ultra-low power consumption and embedded memory processes, we contribute to the realization of the IoT world and a sustainable society in which people and technology live in harmony.

World Technology Service




Technology

Ultra-Low Power Technology

In order to achieve the ultra-low power consumption that is necessary for mobile and wearable devices, we developed the "C55DDC" technology. "C55DDC" is a technology having transistors that can operate at ultra-low voltage and ultra-low leak transistors. These transistors adopt a structure that is different from conventional CMOS in order to achieve ultra-low power consumption.

As a result, the "C55DDC" achieves a reduction in power consumption of approximately 50% at the same operating speed when compared to the "C55LP". Furthermore the leakage current of the ultra-low leak transistors has been decreased to pico-ampere levels, and even to femto-ampere levels.

Gate Diagram

DDC transistor structure


The Deeply Depleted Channel (DDC) technology for 55 and 40nm can be shortly summarized as:

DDC = FD-SOI features @ 55nm/40nm wafer cost



Plugin Flash

MIFS is adding a plugin Flash option to the DDC processes. Plugin Flash comes with two advantages. Beside lower cost this option also provides lower power compared with conventional embedded Flash technologies.

Nonvolatile memories

Nonvolatile memories are embedded in a variety of electrical equipment such as automobiles, IC cards, smart meters, etc. We mount nonvolatile memories with high CMOS compatibility our customers' products at the lowest cost.

RF

Wireless communication is a key word in the rapidly progressing IoT society. Our ULP/LP technology comes with PDK and the devices necessary for RF design (such as varactors, inductors, and MOM/MIM capacitors), allowing us to provide optimal RF solutions to our customers.

MIFS process overview

Process Overview


For more information please check out our Foundry Services TechnologyOpen a new window page.

Shuttle service

The Shuttle Service validates your design with a reasonable cost. Mask and wafer costs are significantly reduced by letting multiple designs share them. Try our shuttle service and realize Mie Fujitsu Semiconductor's technology and service.

  55nm 40nm
User area 4.070mm x 4.070mm 3.960mm x 3.960mm
Metal Layers 6Cu + 1Al and over
Form of delivery Bare dies
Delivery quantity 50dies / wafer

Please find the schedule hereOpen a new window and feel free to contact usOpen a new window for more information!

Wafer fab

Mie Fujitsu Semiconductor inherited the Mie 300mm fab from Fujitsu Semiconductor Limited. The fab started operations in 2005.

From the beginning of operations, this fab has been mainly providing foundry services for the advanced logic LSIs, and has established manufacturing, information management, quality control, and customer support systems for the foundry business In accordance with ISO14001.

According to the ISO9000 series and automotive ISO/TS16949 certifications, the wafer fab has established quality assurance and control systems.

Fab B1

Fab B2

Start of operations

2005

2007

Total floor area

38,000m²

80,000m²

Clean room area

17,000m²

15,000m²

Location

Kuwana City, Mie Prefecture

Wafer size

300mm

Process technology

40nm, 55nm, 65nm, 90nm

Production capacity

About 35,000 wafers/month

International Certifications

ISO9001, ISO14001, ISO/TS16949

Major features

We deal with the risk of large-scale disasters by having clean rooms with earthquake-proof construction, a liquefied natural gas satellite base, and NAS batteries.

Applications

The MIFS standard process portfolio can be utilized for almost any application, while the new process developments are mainly targeted for low and ultra low power applications such as:

  • IoT
  • Wearable devices
  • Battery operated products
  • Battery-less products

Introduction Video

Environment

Environmental Report

Mie Fujitsu Semiconductor Environmental ReportOpen a new window (1.49 MB)

Fujitsu Group Acquisition of Worldwide Integrated Certification

Certification


Our company acquired the global environmental management system certification which complies with ISO 14001.

Regulatory Authority: Japan Audit and Certification Organization for Environment and Quality (JACO)
Registration number: EC98J2005 (Certified worldwide as Fujitsu Group)
Certified on: March 14, 2001

Updated on: March 23, 2015
Valid till: March 22, 2018