FWM7BLZ61 Bluetooth 5.0 Dual Mode Wireless Module
Fujitsu Components Asia today announced the FWM7BTZ61 series of Bluetooth® Ver. 5.0 (dual mode) wireless radio modules compatible with both Bluetooth Low Energy and legacy Bluetooth Classic BR/EDR, giving designers the flexibility to choose between the two modes with one module.
The fully integrated FWM7BTZ61 series is powered by Cypress Semiconductor's CYW20819 SoC and features Bluetooth Low Energy profile an Bluetooth Classic (BR/EDR) power class 2 capabilities in a single module. It also supports Bluetooth Ver. 5.0’s signature X2 communication.
The symbol rate and data rate accommodates both 1Mbps and improved 2Mbps to facilitate communication speed with other Bluetooth Low Energy devices. In addition, Classic mode supports 1Mbps (BR: basic rate) and 2 and 3Mbps (EDR: Enhanced Data Rate) communication.
The series also supports a wide range of operating voltages from 1.71V to 3.63V, which enables the mating with various system design and power supply conditions.
To accommodate different design needs, the series portfolio includes two, fully certified models:
Limited samples are available now and orders will be accepted in January 2021. Contact sales support for more information and pricing.
Specification overview:
Item | Fujitsu Component Radio Module |
Part Number | FWM7BTZ61-xxxxxx |
Bluetooth wireless technology standard | Bluetooth Specification version 5.0 Dual Mode
|
Carrier frequency band | 2,400 MHz to 2,483.5 MHz |
SoC | Cypress CYW 20819 |
Antenna | Integrated |
Crystals | 24MHz and 32.768KHz integrated |
Hardware interface | UART |
Software interface | Fujitsu Component original command system |
Power supply voltage | 1.71 V to 3.63 V |
PCB Mount method | Surface mount |
Dimensions | 17.6 x 10.6 x 1.9 mm |
Operating temperature | -30 to 85 °C |
Certification (scheduled acquisition) | FCC, ISED, CE, Radio Act (Japan) |
Note 1: The Auth. 3.0 CP chip must be implemented on the customer's equipment. If you wish to use the Auth. 30 CP chip with connection, you will need to take necessary steps such as participating in the Apple Inc. MFi License Program.
Fujitsu Components Asia Limited markets and distributes electronic components throughout Asia and Australia. Products include relays, connectors, input and pointing devices, touch panels, wireless modules, and thermal printers. The company is headquartered at 102E Pasir Panjang Road, #01-01, Citilink Warehouse, Singapore 118529. For product information, telephone 65-6375-8560, email fcal@sg.fujitsu.com.
For more information, please see: www.fujitsu.com/sg/products/devices/components/
Press Contact - Fujitsu Components Asia
Address: 102E Pasir Panjang Road, #01-01 Citilink Warehouse Complex Singapore 118529
Phone: (65) 6375 8560
E-mail: fcal@sg.fujitsu.com
Company:Fujitsu Components Asia Ltd.
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Date: 26 October, 2020
City: Singapore
Company:
Fujitsu Components Asia, Ltd.