Fujitsu Releases Vertical-Mount, SMT DDR2 DIMM Socket With Improved Module Mating and Low Lead Coplanarity

Fujitsu Components Asia Limited today introduced a vertical, surface-mount DDR2 (double data rate) DIMM (dual in-line memory module) socket connector with an enhanced contact design and 0.1mm lead coplanarity.

The new 240-position, FCN-078J series card-edge socket features a patented, split-beam contact structure that improves module mating reliability. As a memory module is inserted into the socket, the unique twin-contact’s wiping action removes dust and flux residue and provides a robust connection between the module and socket even in high-vibration environments. Dual latching mechanisms ensure correct module retention and removal.

The RoHS-compliant, FCN-078J uses Fujitsu’s own precision stamping and molding technology to achieve 0.1mm coplanarity before and after reflow. This low-coplanarity specification contributes to improved manufacturing throughput yields. Applications include blade servers, switches, routers, telecom racks, and test and measurement equipment to minimize occupied board space and improve air flow.

The FCN-078J socket measures 22.7mm high x 140mm long. It has an operating temperature range of -55 to +85C degrees, a voltage rating of AC25V and a maximum current rating of 0.5A per contact. Heat resistant tape on the top of the connector facilitates use with pick and place equipment. Solder bars in the middle and on the outside edges of the connector assure accurate IR processing when soldering the connector to the PCB.

Available immediately, the FCN-078J DDR2 DIMM socket is priced at $3.00 each in 10,000-piece quantities.