PCB Connector Optimizes LVDS Differential Signal Transmission of 3.125GBPS and above over FR4 Material

Fujitsu Components Asia has expanded its high-speed, matched-impedance MicroGiGaCN® connector board-to-board (mezzanine) connector series with the addition of a right-angle socket for high-speed data-link / LVDS applications in datacom/telecom applications, optical modules interface applications, high-speed video equipment, high speed test equipment, logic analyzers, medical instrumentation, and other emerging high-speed applications.

The FCN-260(D) MicroGiGaCN series enables differential signal transmission of 3.125 Gbps and above over standard FR-4 material. Its design is based on a modified strip line structure that shields each signal pair, resulting in +/- 10% impedance matching, and near end crosstalk of 4% or less at 50ps rise time.

The new right-angle, board-to-board socket is available in 12, 24 and 36 pairs, and is intermatable with Fujitsu’s plug connector, which has variable heights of 8, 10, 12, and 14mm. It features a 0.75mm signal-to-ground contact pitch, a 1.5mm signal-to-signal contact pitch, and a 0.5mm SMT lead pitch. The SMT leads use a lead-free process with gold coating in place of solder.

The connector is rated at DC 30V, 0.5A (signal) and 1.0A (ground). It features two-level sequential mating of contacts for active connect and disconnect for hot pluggability, and blind mating guides.

Available immediately, a right-angle stacking, board-to-board FCN260(D) is priced at $5.50 per device in 10K piece quantities.