The Shuttle Service is a test production service that uses MPW (multi-project wafer).
Because multiple customers share mask and wafer resources, the service makes it possible to manufacture test chips at low cost.
MIFS provides the shuttle service for 55 nm and 40 nm. It is available for use by a variety of customers in Japan and abroad.
We are prepared to respond flexibly to your requests. Please do not hesitate to inquire.
|User area||4.070mm x 4.070mm||3.960mm x 3.960mm|
|Metal Layers||6Cu + 1Al and over|
|Form of delivery||Bare dies|
|Delivery quantity||50dies / wafer|
|Tape-out date||Beginning - March||
|Beginning - September||Beginning - December||TBD|
|Tape-out date||Mid - January||Mid - April||End - July||End - October||TBD|
We will make estimates based on the chip size and number required.
We will conclude non-disclosure agreements (NDA) and other agreements.
|3. Data releasing
We will release PDK, library materials, documents, etc.
|4. Shuttle entry
Please apply shuttle.
|5. Chip designing|
|6. Data releasing
We will ask you to send GDS data to us.
|7. Data checking
We will check design data.
We will provide progress reports.
We will send die and WAT data.
Mie Fujitsu Semiconductor Limited
Business Development Division
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