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Quality Assurance Program

ISO9001・ISO Certificate of Fujitsu Semiconductor

Our company conducts evaluations and examinations of semiconductor devices according to our quality assurance program at every stage from market research and planning to design prototype development and mass production.
Creating quality starts from the planning stage for semiconductor devices. We conduct market research to ascertain and analyze customer requirements, incorporate these into product planning and then apply that to quality.
Continuing from the product-planning stage, we incorporate consistent quality in all stages of design, prototype development and mass production.

  • Quality Assurance Flowchart

Quality Assurance Flowchart

Design Reviews

From the time that market research, product planning and development planning are completed until mass production begins, we conduct design reviews at each step of the development stage.
The design review in our Quality Assurance Program is composed of five steps from DR0 to DR4.

  • Design Review System
Design Review Content
Planning Review
The Development Planning Review evaluates the processes, circuits, materials and equipment to be used for the new product.
It also establishes a schedule for DR1, DR2 and DR3.
Technical Review
The results of DR0 determine the basic design for the product characteristics and reliability. Pilot circuits are produced for evaluation, and the basic technology is established. The Technical Review examines this basic design to verify that the development technology is appropriate.
Product Review
Characteristics, functions and reliability of pilot products are verified at this stage. Conditions and specifications for pilot mass production are determined, and other steps are taken to prepare for mass production.
Mass Production Review
Before mass production, product evaluations and Mass Production Approval Tests are conducted on the pre-mass production products. The Mass Production Review confirms the findings of the Mass Production Approval Tests including the specifications and equipment allocations required for mass production, and makes the final decision to begin mass production.
Mass Production
Stability Review
Review to confirm stability and long-term reliability of production after starting mass production. Implemented three months after shipping or approximately 30 lots after starting mass production.

FMEA(Failure Mode and Effects Analysis)

FMEA has been incorporated into our product designs to evaluate the three items including the degree of effect, the degree of occurrence and the degree of detection of failures that can occur and their causes. A risk index (degree of importance) is formed by combining the values recorded for above three items.
Countermeasures are undertaken starting with items having high numerical values. Implementing FMEA allows us to confirm that countermeasures are being implemented for predicted failures, and is useful in making corrections and taking steps for prevention.

  • Sample of FMEA Sheet

FMEA Sheet

Reliability Tests

  • Process Qualification Test
    To ensure the reliability of newly developed technologies, we conduct process qualification using TEGs (Test Element Groups)* for all fundamental failure modes.
    * TEG (Test Element Group): A group of elements used to evaluate and identify failure modes.
  • Process Qualification Test Items
Test Item Factor Main Acceleration Factor
Electromigration Wiring materials, structure,
current density
Current density, temperature
Stress Migration Wiring materials, structure Temperature, stress
Hot Carrier Injection Transistor structure,distribution of impurities Electric field
Gate Oxide Integrity Structure, oxide film characteristics Electric field, temperature
Negative Bias Temperature Instability Transistor structure,oxide film characteristics Electric field, temperature
  • Mass Production Approval Tests
    These tests are conducted for mass production approval and include technical factors that affect a product's reliability. The tests also consider new technological factors or newly combined technological factors. We use TEG or representative products that relate to actual products by using grouping method of our products.
  • Mass Production Approval Test Items
Test Item Conditions JEDEC Standard Number Purpose of Test New Process Technology Launch New Assembly Package Technology Launch
High Temperature
Operating Life Test*
HTOL 125℃ JESD22-A108 Evaluates device durability when operated for long periods under high-temperature environments.
Temperature Humidity
Bias Life Test*
THB 85℃、85%RH JESD22-A101 Evaluates device durability when operated for long periods in a high-temperature, high-humidity atmosphere.
Temperature Cycling Test* TC -65℃ up to 150℃ JESD22-A104 Evaluates device durability in repeated high and low temperature situations.
Highly Accelerated
Stress Test
HAST 130℃、85%RH JESD22-A110 Evaluates durability when device is stored in a bias-charged state in a high-temperature, high-humidity atmosphere.
Unbiased HAST UHAST 130℃、85%RH JESD22-A118 Evaluates durability when device is stored in a high-temperature, high-humidity atmosphere.
Low Temperature
Operating Life Test
LTOL -55℃ JESD22-A108 Evaluates device durability when operated for long periods under low-temperature environments.
High Temperature
Storage Life Test
HTSL 150℃ JESD22-A103 Evaluates device durability when stored for long periods under high-temperature environments.
Evaluates retention (data retention) characteristics with FRAM.
Endurance Test Endurance Operation
Evaluates durability in repeated writing of data.
Thermal Shock Test TS 0℃ up to 100℃ JESD22-A106 Evaluates durability in sudden heat changes.
Early Life Failure Rate Test ELFR 125℃ JESD74 Evaluates initial reliability of device use.
Electrostatic Discharge
Sensitivity Test
(Human Body Model)
HBM JS-001 Evaluates device durability when static electricity discharges are received by human body model.
Electrostatic Discharge
Sensitivity Test
(Charged Device Model)
CDM JS-002 Evaluates device durability when static electricity discharges are received by a device.
IC Latch-up
Resistance Test
LU JESD78 Evaluates device resistance to latch-up.
Thermal Characterization Evaluates electrical characteristics under low, room, and high temperatures.
* For Surface mount type package, implements tests by adding thermal stress envisioning surface mounting before test. ○:Implemented,
-:Not implemented

Design Change, Process Change

When Design change and / or Process Change are proposed internally, a primary review meeting organized by the QA department and other relevant departments is held to study the changes.
In order to confirm that there are no differences in quality and reliability to our existing products, evaluation and qualification tests are performed if needed. The manager of QA department finally approves the changes before the application.
We notify our customers of changes in advance when we judge the changes could affects the products and / or process of customers from the viewpoint of quality, reliability, electrical characteristics, device dimensions, external appearance, and ease-of-use.

  • Flowchart of Design Change and Process Change

Flowchart of Design Change and Process Change


Fujitsu Semiconductor controls manufacturing logs of all devices from the wafer process to assembling, testing, and shipping so that we can trace the manufacturing history when any problem occurs in the market or manufacturing process of a customer.
Manufacturing history of each device can be identified by the marking on each device package.

Marking Example
Marking Example

Customized Quality Programs to Meet Diverse Customer Requirements

Fujitsu Semiconductor has the customized quality assurance programs which can provide higher quality and higher reliability products to meet diverse customer requirements. These optional programs are optimized to automotive applications or similar high-quality requirement applications in some cases.
These products can usually be identified by a specific parts number such as -GS grading.
Following table shows the example of our specific quality assurance programs.
Please contact us for more details of such customized quality programs.

  • Special Quality Assurance Support Example
Items of Requirement Content of Requirement
Reliability Evaluation (Qualification) Level Support of AEC-Q100 compliance
Information on Our Quality Control Request of PPAP contents supply
(FMEA, control plan, MSA, and others)
Requirements of Our Suppliers Requirement of obtaining IATF16949 certification
Other Requirements Request of quality targeted Low FIT rate, low ppm, optional screening

FRAM Sample/Document Request & Inquiry Form

Sample/Document Request
For requests of evaluation samples, and/or
documents such as datasheets, brochure

For general questions, such as technical
inquiry, sample availability, pricing