Our company conducts evaluations and examinations of semiconductor devices according to our quality assurance program at every stage from market research and planning to design prototype development and mass production.
Creating quality starts from the planning stage for semiconductor devices. We conduct market research to ascertain and analyze customer requirements, incorporate these into product planning and then apply that to quality.
Continuing from the product-planning stage, we incorporate consistent quality in all stages of design, prototype development and mass production.
Quality Assurance Flowchart
From the time that market research, product planning and development planning are completed until mass production begins, we conduct design reviews at each step of the development stage.
The design review in our Quality Assurance Program is composed of five steps from DR0 to DR4.
Design Review System
The Development Planning Review evaluates the processes, circuits, materials and equipment to be used for the new product.
It also establishes a schedule for DR1, DR2 and DR3.
The results of DR0 determine the basic design for the product characteristics and reliability. Pilot circuits are produced for evaluation, and the basic technology is established. The Technical Review examines this basic design to verify that the development technology is appropriate.
Characteristics, functions and reliability of pilot products are verified at this stage. Conditions and specifications for pilot mass production are determined, and other steps are taken to prepare for mass production.
Mass Production Review
Before mass production, product evaluations and Mass Production Approval Tests are conducted on the pre-mass production products. The Mass Production Review confirms the findings of the Mass Production Approval Tests including the specifications and equipment allocations required for mass production, and makes the final decision to begin mass production.
Review to confirm stability and long-term reliability of production after starting mass production. Implemented three months after shipping or approximately 30 lots after starting mass production.
FMEA（Failure Mode and Effects Analysis)
FMEA has been incorporated into our product designs to evaluate the three items including the degree of effect, the degree of occurrence and the degree of detection of failures that can occur and their causes. A risk index (degree of importance) is formed by combining the values recorded for above three items.
Countermeasures are undertaken starting with items having high numerical values. Implementing FMEA allows us to confirm that countermeasures are being implemented for predicted failures, and is useful in making corrections and taking steps for prevention.
Sample of FMEA Sheet
Process Qualification Test To ensure the reliability of newly developed technologies, we conduct process qualification using TEGs (Test Element Groups)* for all fundamental failure modes. * TEG (Test Element Group): A group of elements used to evaluate and identify failure modes.
Process Qualification Test Items
Main Acceleration Factor
Wiring materials, structure,
Current density, temperature
Wiring materials, structure
Hot Carrier Injection
Transistor structure,distribution of impurities
Gate Oxide Integrity
Structure, oxide film characteristics
Electric field, temperature
Negative Bias Temperature Instability
Transistor structure,oxide film characteristics
Electric field, temperature
Mass Production Approval Tests
These tests are conducted for mass production approval and include technical factors that affect a product's reliability. The tests also consider new technological factors or newly combined technological factors. We use TEG or representative products that relate to actual products by using grouping method of our products.
Mass Production Approval Test Items
JEDEC Standard Number
Purpose of Test
New Process Technology Launch
New Assembly Package Technology Launch
Operating Life Test*
Evaluates device durability when operated for long periods under high-temperature environments.
Bias Life Test*
Evaluates device durability when operated for long periods in a high-temperature, high-humidity atmosphere.
Temperature Cycling Test*
-65℃ up to 150℃
Evaluates device durability in repeated high and low temperature situations.
Evaluates durability when device is stored in a bias-charged state in a high-temperature, high-humidity atmosphere.
Evaluates durability when device is stored in a high-temperature, high-humidity atmosphere.
Operating Life Test
Evaluates device durability when operated for long periods under low-temperature environments.
Storage Life Test
Evaluates device durability when stored for long periods under high-temperature environments.
Evaluates retention (data retention) characteristics with FRAM.
Evaluates durability in repeated writing of data.
Thermal Shock Test
0℃ up to 100℃
Evaluates durability in sudden heat changes.
Early Life Failure Rate Test
Evaluates initial reliability of device use.
(Human Body Model)
Evaluates device durability when static electricity discharges are received by human body model.
(Charged Device Model)
Evaluates device durability when static electricity discharges are received by a device.
Evaluates device resistance to latch-up.
Evaluates electrical characteristics under low, room, and high temperatures.
* For Surface mount type package, implements tests by adding thermal stress envisioning surface mounting before test.
Design Change, Process Change
When Design change and / or Process Change are proposed internally, a primary review meeting organized by the QA department and other relevant departments is held to study the changes.
In order to confirm that there are no differences in quality and reliability to our existing products, evaluation and qualification tests are performed if needed. The manager of QA department finally approves the changes before the application.
We notify our customers of changes in advance when we judge the changes could affects the products and / or process of customers from the viewpoint of quality, reliability, electrical characteristics, device dimensions, external appearance, and ease-of-use.
Flowchart of Design Change and Process Change
Fujitsu Semiconductor controls manufacturing logs of all devices from the wafer process to assembling, testing, and shipping so that we can trace the manufacturing history when any problem occurs in the market or manufacturing process of a customer.
Manufacturing history of each device can be identified by the marking on each device package.
Customized Quality Programs to Meet Diverse Customer Requirements
Fujitsu Semiconductor has the customized quality assurance programs which can provide higher quality and higher reliability products to meet diverse customer requirements. These optional programs are optimized to automotive applications or similar high-quality requirement applications in some cases.
These products can usually be identified by a specific parts number such as -GS grading.
Following table shows the example of our specific quality assurance programs.
Please contact us for more details of such customized quality programs.
Special Quality Assurance Support Example
Items of Requirement
Content of Requirement
Reliability Evaluation (Qualification) Level
Support of AEC-Q100 compliance
Information on Our Quality Control
Request of PPAP contents supply
(FMEA, control plan, MSA, and others)
Requirements of Our Suppliers
Requirement of obtaining IATF16949 certification
Request of quality targeted Low FIT rate, low ppm, optional screening
FRAM Sample/Document Request & Inquiry Form
For requests of evaluation samples, and/or
documents such as datasheets, brochure
For general questions, such as technical
inquiry, sample availability, pricing