|Exhibition||JPCA Show 2019
|Dates||Jun. 5 [Wed] - 7 [Fri], 2019
10:00-17:00 (Last day until 16:00)
|Venue||Tokyo Big Sight West Hall 4
||How to get there
|Booth||No. 4 –248 Exhibitor information||Invitation Download|
Making a leap from a total PCB manufacturer to a solution provider!
|1.||High Density and Low-Loss PCBs|
Introduction of high-density and low-loss PCBs for high-performance computing, 5G related devices and EHF devices.
|2.||PCB Application of our Innovative “F-ALCS” technology|
Introduction of the F-ALCS technology enabling huge wiring capacity for special purpose processing units using large computing power, and high density Organic Wafer Probe Cards for the latest 5G devices.
|3.||PCB Solution services for product development|
We expand our solution menu from circuit design to PWB and PCB manufacturing services, along with design solution with electrical & thermal stress simulation.
Date: 22 May, 2019