We are pleased to inform you that we will participate at the 20th PWB EXPO 2019 Exhibition (Nepcon Japan 2019).
We will be co-exhibiting with FUJITSU ADVANCED TECHNOLOGIES Ltd. and FUJITSU KYUSHU NETWORK TECHNOLOGIES Ltd. under the theme: "Comprehensive Strength of the FUJITSU Group for your Next-Generation Product Development."
Our technologies and solution services will provide our customers with added value in each phase of the product development process.
This year, we will be introducing our innovative Any Layer IVH structure "G-ALCS" technology for multilayer glass substrate.
We hope to see you at our booth!
Comprehensive Strength of the FUJITSU Group
for your Next-Generation Product Development
Innovative Any Layer IVH structure "G-ALCS" TechnologyNEW
A Hybrid Glass Multi Layer PCB prototype developed with our innovative G-ALCS technology will be exhibited. The use of a conductive paste for the Glass Any Layer IVH formation allows to considerably reduce its manufacturing lead-time and to solve the CTE mismatch issue.
PCB Solution Services for Product Development
Our solution menu expands from circuit design to PCB and PCBA manufacturing services along with design solutions including electrical and physical simulation.
This year, some design support tools for automotive applications and an AI edge computing node for IoT applications will be displayed !
Come to our booth to hear more about our solutions! We will cover 7 different subjects.
Please note that this content may be subject to modification.