- Occupational Health and Safety
- PCBs & IC Substrates
- Topics & informations
GigaModule-EC adopts a technology which enables decoupling capacitors to be embedded on a substrate right beneath a LSI to operate in high frequencies with low voltages. The GigaModule substrate can be used for build-up or coreless substrates.
High-density wiring structure for high-density bump interconnect.
Suitable for high frequency operation over 10GHz.