We provide thick copper PCBs with maximum 500μm for large-current applications.
A highly effective heat conducting path is formed with the copper coin between PCB top and bottom, which enables to conduct the heat generated from the device efficiently to the opposite side of PCBs.
Applying high heat radiation material to PCBs enables significant improvements in conduction of heat to horizontal direction (x-y axis). As the electrically insulated high heat dissipation material is applied to PCBs, the high heat spots from power devices is distributed in the horizontal direction.
We propose the best PCB technology solution for various demands for large current and high heat radiation. The feature of our PCB technology is shown as below.
|High current with thick copper
|High heat dissipation materials
＜xy-axis heat dissipation＞
＜z-axis heat dissipation＞
|High current||Better||-||(Under development)|
|Device heat radiation||Good||Good||Better|
We can solve the problem for large-current and power device heat radiation with total PCB solutions!
|Layer Construction||22 layers|
|PCB Size, Thickness||599mm × 694mm, 6.36mm|
|Copper Thickness (Inner layers)||35µm,70µm,105µm, 175µm (4 types)|
|Layer Construction||8 layers (2-4-2)|
|PCB Size, Thickness||320mm × 192mm, 1.2mm|
|Line / Space||100µm / 100µm|
|Thermal conductivity||1.5 – 2.5W/(mK)|
|Layer Construction||4 layers|
|PCB Size, Thickness||147mm × 145mm, 2.75mm|
|Line / Space||200µm / 150µm|
|Copper Thickness (Inner layers)||500µm (L2, L3 layer)|
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