GTM-MML4VXJ
Skip to main content

日本語

Japan

  1. Home >
  2. Business Partners >
  3. Global Partners >
  4. Winbond Electronics

Winbond Electronics Corporation

Web Site


Company Overview

  • Company name: Winbond Electronics Corp.
  • Establishment: September, 1987
  • Head office: Taiwan, Taichung
  • Products: DRAM,SDRAM,Serial Nor Flash,Serial NAND Flash, Secure Flash
  • Production Capacity: 48k wafers//M(DRAM 26k, Flash 22k)
  • Technology:Flash:In mass production:90nm/58nm/46nm(NAND), Under development:32nm
                                  (NAND)
                       DRAM:In mass production:65nm/46nm/38nm, Under development:25nm
  • New plant :to be launched in 2020 to 2021

Features

Winbond can provide wide range product solutions such as DRAM, Flash, MCP, KGD from their own factory. Winbond specializes in the Low/Intermediate density Specialty memories and ranks first in that field. (※Except for PC, main memory for server, memory for bulk data storage for smart phone) Winbond has the products adopted to various automotive applications including ADAS. Winbond is focusing on “4C” Applications.

  • Car&Industrial
  • Consumer
  • Computer
  • Communication

入力フォーム Inquiry