Abstracts of Magazine FUJITSU 2005-11 (VOL.56, NO.6)

Special Issue : Innovative Manufacturing and Engineering

• Fujitsu's Management of Innovative Manufacturing and Engineering

Fujitsu initiated activities in 2003 to promote innovative manufacturing by taking advantage of its highly value-added manufacturing and targeting improved skill levels for all its employees. Our manufacturing environment has changed significantly as production sites have been relocated to Southeast Asia and China, coupled with increased unit purchasing and less value being added internally due to fractionization and increasing openness in technology. Based on an analysis of this changing environment, this paper outlines Fujitsu's commitment to promoting innovative manufacturing activities by focusing on servers, networks, personal computers, and mobile phones from the standpoint of improving Quality, Cost, and Delivery (QCD) in these fields of manufacturing. This paper also describes Fujitsu's efforts in achieving total cost reduction for improved competitiveness by applying these innovation activities to every phase of operation beginning with individual plants and engineering sites through the design process, manufacturing positioned upstream of the development process, and supply-chain management.

• Introduction of Toyota Production System to Promote Innovative Manufacturing

Until recently Fujitsu has employed various strategies to improve productivity and efficiency at its individual factories and business units. In 2003, however, we introduced the Toyota Production System (TPS) throughout the company to promote innovative manufacturing. This system is intended to achieve company-wide innovation not only at the plant level, but also for product delivery from sales sections to the customer and for processes upstream of design and development. The system is still under construction and we are now addressing various problems posed at each factory and business unit. This system is also intended to bring innovation to the processes involved between the plants, suppliers, and customers by linking with upstream development sections. This paper examines the progress of introducing TPS by using a case example of our Information & Communucation Technology product factories.

• Innovative Manufacturing Activities in Fujitsu Group Plants

Fujitsu initiated innovative manufacturing activities company-wide in 2003, and is now promoting innovative activities at each plant under the guidance of a consultant for the Toyota Production System (TPS). This paper describes the innovative manufacturing activities undertaken at Fujitsu Component Limited (FCL), and then introduces Fujitsu IT Products Ltd. (FJIT) and the Fujitsu Nasu Plant (mobile system manufacturing) that are promoting innovative activities which began in April 2004 at their facilities under TPS consultant guidance. Finally, this paper examines related activities under way at Shimane Fujitsu Ltd. (SFJ), which has received guidance from the TPS consultant since April 2005.

• Visibility of Manufacturing-Related Issues Using "Shunsaku"

Fujitsu has taken up the challenge of implementing Supply Chain Management (SCM) to strengthen its server and network products business. Under SCM, it is important to balance supply and demand. However, because manufacturing is becoming increasingly complex, various issues that obstruct balancing efforts have emerged in numerous areas. These issues can have a significant negative impact, for example, delayed delivery to customers, unless they are identified at the proper time and then immediately resolved. Fujitsu has therefore been developing IT solutions that identify and visualize manufacturing-related issues such as changing production plans and sudden shortages of parts at the appropriate time. This paper introduces three visibility solutions that use Interstage Shunsaku Data Manager (Shunsaku) to keep track of daily inventory records, trace the causes of redundant parts, and monitor the manufacturing status of ordered products.

• Assembly Technology for High Performance PCBAs

Servers and other network equipment contain high-performance Printed Circuit Board Assemblies (PCBAs). Some PCBAs, such as those on which CPUs are mounted, are very large and densely packed with leading-edge electronic packages and components. Therefore, the manufacture of these PCBAs requires more efficient and precise assembly technology than ordinary PCBAs. Moreover, the behavior of PCBA packages and components during assembly must be fully understood beforehand so that suitable measures can be taken to protect against any damage. This paper describes an assembly technology for these large-scale PCBAs that are processed using reflow soldering, as well as a technology for mounting high-dissipation heatsinks onto packages.

• New Technology for High-Density LSI Mounting in Consumer Products

The ongoing trend toward downsizing and the growing sophistication of electronic devices require increasingly higher LSI mounting densities. Flip-chip technology is employed to mount LSIs without using wire and thus enables higher mounting densities than conventional mounting technology, which uses Au wire bonding. Fujitsu has developed a new high-density flip-chip assembly technology for use in consumer products to reduce size and improve performance. This paper describes the bumping technology, assembly process, results of reliability tests, and applications of this new technology. It also examines Fujitsu's efforts in developing an ultrasonic assembly technology that achieves high throughput and reduced cost.

• Assembly Technology Using Lead-free Solder

To comply with the RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) Directive to be enforced on July 1, 2006, the major technical issue that must be addressed regarding the six substances restricted by RoHS is replacing lead, which is used in said equipment in a variety of ways. In order to replace lead, especially with regard to solder (the so-called basic material of electronic assembly), the heat resistance of electronic components must be strictly controlled. Moreover, a means must be devised to maintain uniform temperature for each material and component at reflow soldering since commonly used Tin-Silver-Copper (Sn-Ag-Cu) solder, if adopted, requires a higher soldering temperature than lead containing solder. Additionally, it is important to clarify the properties, quality, and reliability of any new, alternative solder materials. Fujitsu has been pursuing comprehensive engineering, such as developing basic lead-free solder materials, to apply lead-free solder to the products. This paper introduces Fujitsu's activities toward addressing the technical issues posed by lead-free soldering technology.

• Micro Assembly Machine

Recently, production demand in manufacturing industries has changed drastically from high-mix, low-volume production to high-mix, variable-volume production. At Fujitsu, we are promoting innovative engineering through making effective use of existing equipment without the need for initial investments and by implementing the Toyota Production System. Two major themes of manufacturing in the future will be the creation of strong production systems that can adapt to market changes while holding down investment and eliminating waste and the development of equipment suitable for those changes. To assist in this area, Fujitsu now offers a low-cost, ergonomically designed micro-assembly machine that can be used in comprehensive applications ranging from small trials to mass production. This machine has the high speed and accuracy of existing equipment and provides greater flexibility and economy during manufacturing and product changes. This paper describes this new machine.

• Precise Micro Machining Technologies

IT equipment contains many different precision-machined parts, such as semiconductor devices. Therefore, developing the next generation of compact mobile phones, IT terminals, and other highly advanced devices for the ubiquitous computing era requires parts of fine detail, high precision, and high quality. Fujitsu's advanced processing technologies allow us to manufacture high-quality, highly value-added precision-machined microcomponents at low cost. This paper introduces four practical examples of these precise processing technologies: super-precision lap processing, micro-laser machining, precise injection molding, and fine-detail metal pressing.

• 3-D Measurement Technologies for Production Uses

Three-dimensional measurement is a very important elemental technology in manufacturing. Because of the increasingly fine structure of modern components, this technology must be extremely fast and accurate. In this paper, we introduce some examples of how triangulation and optical interference are used in the 3-D measurement technologies that have been developed so far. First, we describe a high-speed bump-height measurement system that uses triangulation. Next, we describe some magnetic disk components (slider ABS and disk micro-waviness) and a micro-optical measurement technology for testing light-guard plates using optical interference. Finally, we introduce a dynamic technique for measuring the behavior of micro-electro-mechanical systems (MEMSs).

• Integrated Development System That Supports Innovative Manufacturing

To quickly satisfy such manufacturing requirements as production, assembly, testing, and maintenance, and market requirements for higher performance, miniaturization, and cost reduction, an innovative design methodology is needed to enable the optimization of an entire development process through a single operation without repetition. The Fujitsu Group is promoting innovative manufacturing and engineering activities by constructing an integrated design environment for the entire Group. This environment includes the "EMAGINE" electrical CAD environment that addresses the requirements above by providing simulation tools for design processes, applying DFM/DFT, and enabling cooperation with the structural design process. This paper introduces EMAGINE by focusing on the support system for innovative manufacturing. It also describes new environments for noise simulation design and structural design.

• Visualization for Development Processes and Project Management

The environment surrounding enterprises is both complex and rapidly changing. To deal with this situation, it is essential to clearly visualize complex product development processes and manage projects properly. To address these needs, we have initiated two activities that focus on the level of process maturity. The first activity is standardizing low-maturity processes for obtaining certification of environment friendliness and developing the necessary support systems. The second activity is standardizing and optimizing the product design processes and project management system that supports project work operations for high-maturity processes. This paper describes these activities in terms of Capability Maturity Model Integration (CMMI).

• Quality Engineering: Taguchi Method

It is always necessary to review development processes for supplying better products as soon as possible to meet complex market demands. Quality engineering (known as the Taguchi Method) is a systematized methodology of technological development now attracting much attention. Quality engineering focuses on the functionality (basic function) of products, with three main factors that categorize a given system: the signal factor, control factor, and error factor. Quality engineering may be difficult for engineers who are accustomed to conventional methods. Therefore, to ensure innovative manufacturing, the attitudes of engineers and the organizations to which they belong must focus on innovation by promoting use of the Taguchi Method. This paper introduces the activities geared toward promoting quality engineering as an explanatory overview of such analyzing tools as WebSTAT and ParaNAVI, and cites a case study of simulation, process materials, and the evaluation of software.

• Introduction to DFX at Fujitsu

Improvements in product design have conventionally been made after the start of mass production, followed by reductions in cost and lead-time. However, given the shorter product life cycles and high-mix, low-volume production in recent years, it has become increasingly important to carefully optimize productivity from the initial stage of mass production. It is generally agreed that design determines 80% of productivity. Therefore, a design's suitability for mass production must be evaluated through the cooperation of design and production engineers, then the results must be reflected in the design at an early stage of development. These activities are collectively called Design For Manufacturing and Testing (DFX). Fujitsu has introduced DFX to its development of network and server equipment. This paper outlines DFX and gives some examples of how Fujitsu utilizes DFX to improve various products and increase productivity.

• Reducing TTM Development of Mobile Phones through Practical Simulation

Today's ubiquitous network society in which communication is possible anytime, anywhere, and with anyone is now witnessing wide-ranging technological development in the fields of PCs, mobile phone terminals, wireless LAN, IC cards, and security. Conversely, some of these markets, for example, PCs and mobile phone terminals, have matured and future growth is expected to be marginal at best, coupled with intensified competition among makers. To secure a dominant competitive position in such a market environment, Fujitsu must satisfy customer expectations in terms of demand by discriminating the design and functions of products, while shortening product development cycles through QCD (Quality, Cost, and Delivery) activities. Fujitsu has introduced a scientific approach to a development technique that utilizes simulation and taken efforts to reduce TTM (Time To Market) through upstream development targeting quality construction. This paper introduces an example of practical simulation to develop mobile phone terminals.

• Innovation in Software Development Process by Introducting Toyota Production System

Fujitsu Software Technologies [formerly Fujitsu Prime Software Technologies (PST)] has been conducting activities to improve productivity modeled on the Toyota Production System (TPS) since 2003. An agile development process and a store management method were introduced to implement the basic concepts of TPS in the IT software field. We included the basic concepts of TPS [the elimination of Muda (waste), Heijunka (leveled production), Jidoka (automatic detection of abnormal conditions)], and Visual Management in said agile development process and store management method as practical techniques. PST introduced this agile development process to its software development process and the store management method to support its maintenance process. As a result, PST achieved significant improvements in both processes and in its organizational climate. This paper introduces the TPS concepts employed in the agile development process, describes how Heijunka is used in store management, and examines the effects on PST.