Skip to main content

Fujitsu

Global

Archived content

NOTE: this is an archived page and the content is likely to be out of date.

Substrate

GigaModule-EC, a substrate structure with embedded TFC (Thin Film Capacitor) for semiconductor package

GigaModule-EC adopts a technology which enables decoupling capacitors to be embedded on a substrate right beneath a LSI to operate in high frequencies with low voltages. The GigaModule substrate can be used for build-up or coreless substrates.

FC-BGA Substrates GigaModule-2

High-density wiring structure for high-density bump interconnect.