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  7. e-Shuttle and Hong Kong Science and Technology Parks Collaborate to Provide Silicon Shuttle Services for Asian Start-ups

e-Shuttle and Hong Kong Science and Technology Parks Collaborate to Provide Silicon Shuttle Services for Asian Start-ups

Fujitsu Microelectronics (Shanghai) Company Limited

Hong Kong and Tokyo, September 26, 2008

Hong Kong Science and Technology Parks Corporation (HKSTP), and Fujitsu Microelectronics Limited’s (FML) subsidiary e-Shuttle Inc. (ESI) in Japan have signed an agreement to provide silicon shuttle services for start-up integrated circuit (IC) design houses in Asia.

The initiative, boosting Asia’s semiconductor industry, provides first-of-a-kind Electron Beam Direct Writing (EBDW) technology at low cost. The proprietary EBDW technology developed by e-Shuttle significantly lowers the cost of prototyping ICs and reduces turnaround time.

Under the new initiative, HKSTP will provide development support, including design tools and evaluation systems and secured remote access design environment to design houses, which then send timing, power and other data to ESI for prototyping using the EBDW technology. The IC designers evaluate the design or product prototypes from e-Shuttle for recommendation to manufacturers. This process will allow even small and medium-sized design organizations to leverage leading prototyping technologies such as 65nm at very low cost.

The program with e-Shuttle complements HKSTP’s IC Design Centre, which incorporates a wide range of IP services, including test development, IP trial, licensing, integration and verification – plus a legal framework for semiconductor intellectual property development under an ISO 27001 certified design environment.

e-Shuttle was established by Fujitsu Microelectronics Limited and Advantest Corporation to provide low-cost prototyping services for leading edge, large-scale ICs. It extends FML’s silicon shuttle operations with its proprietary EBDW technology.

“Our co-operation with e-Shuttle will enable us to provide small and medium-sized technology developers with access to the most advanced prototyping technologies and FML’s superior wafer manufacturing as well as a one-stop-shop service for design start and production release, governed by global best practices and the rule of IP protection laws of Hong Kong,” said Ir. S.W. Cheung, Hong Kong Science Park’s Vice President for Business Development and Technology Support.

The new partnership supports the rapid growth of Asia’s semiconductor industry, and the shift of IC design from the US and Europe to this region. According to e-Shuttle President Dr Haruo Tsuchikawa, "Working together with HKSTP we will activate new innovation by design houses in the semiconductor industry. HKSTP has the manufacturing support environment that start-ups need. Its secure information security system, together with our technology, is critical to leading-edge IC development."

“Prototyping advanced ICs is usually very costly, including the high cost of reticle lithography. EBDW technology provides a short delivery cycle at less cost with mask-less production,” continued Dr. Tsuchikawa.

“Since its establishment in 2001, HKSTP has been dedicated to IC and associated Silicon IP development by forming strong alliances with key IT vendors, professional IC associations as well as leading universities,” said Mr. Cheung. “This cooperation with e-Shuttle further extends our technology portfolio network to Japan.”


About Hong Kong Science and Technology Parks Corporation

Hong Kong Science and Technology Parks Corporation ("HKSTP") is a statutory body set up by the Government of the Hong Kong SAR. HKSTP provides innovative and technology driven infrastructure and support facilities which includes market-focused clustered laboratory services enabling Hong Kong industries and services to be more competitive; a full-service incubation programme for technology and design start-ups; and fosters partnerships and collaboration between industry and universities/applied research institutes through consulting, training and research programmes. HKSTP offers advanced facilities and support services for high technology companies that include an IC Design Centre, an IC Development Support Centre, a Materials Analysis Laboratory, a Wireless Communications Test Laboratory and an Intellectual Property Servicing Centre.
HKSTP provides one-stop service for IC development, to offer technical support covering the entire process from design to production, backed by a team of seasoned and professional engineers with combined experience of more than 500 person-years.
For more information, please see: http://www.hkstp.org

Cao Miao

Phone: Phone: (86 21) 6146 3688
Fax: (86 21) 6335 1610
E-mail: E-mail: Marcom.sh@cn.fujitsu.com
Company:Fujitsu Microelectronics Asia

Pauline Ko

Phone: Phone: (852) 2629 6710
Fax: (852) 2607 4033
E-mail: E-mail: pauline.ko@hkstp.org
Company:HKSTP

Joyce Mok

Phone: Phone: (852) 2973 0222
Fax: (852) 2973 6900
E-mail: E-mail: hkstp@upstreamasia.com
Company:Upstream Asia

Press Release ID: 2008-09-26
Date: 26 September, 2008
City: Hong Kong and Tokyo
Company: Fujitsu Microelectronics (Shanghai) Co. Ltd.

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