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  7. Fujitsu Microelectronics Launches Mobile WiMAX Chipsets for Mobile Devices

Fujitsu Microelectronics Launches Mobile WiMAX Chipsets for Mobile Devices

Designed to fit in the 12x12mm WiMAX module, featuring standby current of less than 0.5mA

Fujitsu Microelectronics (Shanghai) Company Limited

Shanghai, June 23, 2008

Fujitsu Microelectronics (Shanghai) Co.,Ltd. today announced a new mobile WiMAX chipset optimized for mobile WiMAX devices such as smart phones and PDAs. Sample shipment will start in August 2008. The chipset includes a baseband LSI, MB86K22; an RF LSI, MB86K52; and a power management LSI, MB39C316. These three devices are essential to produce a competitive WiMAX module. The chipset was designed to fit in the 12x12mm WiMAX module. The standby current - which has a direct impact on battery life - will not exceed 0.5mA, facilitating the development of more competitive mobile WiMAX terminals.

Next-generation Mobile WiMAX technology will be deployed in the United States, Europe, and Taiwan this year, and in Japan next year. The initial service will be provided through PC-based mobile broadband access, with simultaneous development of portable devices, smart phones, PDAs, portable games and navigation systems supporting the Mobile WiMAX technology.

The mature software stacks of the chipset have been proven in the previous generation product, and the power management schemes have been optimized at the system level. These advantages enable mobile WiMAX terminal manufacturers to focus on designing attractive user interfaces and service-oriented applications.

“This highly integrated WiMAX chipset features the low power and small form factor essential to the development of attractive mobile WiMAX terminal products,” said Makoto Awaga, General Manager of the Mobile Solution Business Group of Fujitsu Microelectronics Limited in Japan. “Fujitsu Microelectronics has assumed a global leadership position in WiMAX business development, and we have been working with different module vendors to meet market demand.”

Chipset Key Features

MB86K22 is a fully integrated baseband LSI built using Fujitsu Microelectronics 65nm advanced CMOS low-leakage process technology. The operating power of MB86K22 has been reduced by 36 percent from the previous generation. Power-gating technology shuts down the power supply in the unused blocks inside the device, so that the entire mobile WiMAX module consumes only 0.5mA, thereby extending battery life.

MB86K52 is an RF LSI built using CMOS process technology, which supports 2.3GHz, 2.5GHz, and 3.5GHz, covering almost all the frequencies set by the WiMAX Forum. This enables mobile WiMAX terminal manufacturers to introduce their WiMAX devices globally. MB86K52 also supports MIMO and beamforming technology, which is essential for mobile WiMAX Wave 2.

MB39C316 power management LSI eliminates all the complex and time-consuming power management requirements by adopting one-cell battery. This design minimizes the number of external peripheral devices of a module. MB39C316 controls and manages the power schemes of a module at the system level, keeping the power consumption in every operation to the minimum.

Key Specifications

MB86K22 Baseband LSI

Bandwidth 3.5MHz, 5MHz, 7MHz, 10MHz, 20MHz (planned)
Modulation 64QAM / 16QAM / QPSK
FFT size 512/1024 FFT OFDMA
Antenna 2x2 STC/MIMO (MatrixA and MatrixB)
OS Windows Mobile / Embedded Linux
Host interface SDIO, SPI

MB86K52 RF LSI

RF frequencies 2.295GHz - 2.405GHz / 2.491GHz - 2.695GHz / 3.295GHz – 3.620GHz
Bandwidth 3.5MHz, 5MHz, 7MHz, 10MHz, 20MHz
FFT size 512/1024 FFT OFDMA
Antenna 2x2 STC/MIMO (MatrixA and MatrixB)

MB39C316 Power Management LSI

Power supply voltage 2.7V - 4.9V, 1 cell Lithium Ion battery
Output 3-channel DC/DC, 4-channel LDO
Sequence control Power voltage activation/deactivation
Interface I2C

Related Websites

*Fujitsu Microelectronics Mobile WiMAX Solutions:

http://www.fujitsu.com/global/products/devices/semiconductor/assp/

*Fujitsu Microelectronics Mobile WiMAX Module block diagram:

http://www.fujitsu.com/downloads/MICRO/fma/imagelib/bwa/wimax_block.jpg (276 KB)

About Fujitsu Microelectronics Limited (FML)

Fujitsu Microelectronics Limited (FML) is a large-scale integrated circuit (LSI) manufacturer that provides highly reliable, optimal solutions to meet the varying needs of its customers, through LSI offerings including ASIC/COT, ASSP and power management ICs, and flash microcontrollers. Along with building on its wide-range expertise focusing on imaging, wireless, and security LSI applications, FML also pursues initiatives for power efficiency and undertakes environmentally-conscious countermeasures. Headquartered in Tokyo, FML was established as a subsidiary of Fujitsu Limited on March 21, 2008. Through its global sales and development network with sites in Japan and other regions in Asia, Europe, and the U.S., FML offers LSI solutions to the global marketplace.

About Fujitsu Microelectronics (Shanghai) Co.,Ltd.

Fujitsu Microelectronics (Shanghai) Co., Ltd. was established in August 2003 as Fujitsu’s semiconductor business representative in China. Headquartered in Shanghai, it has branch offices in Beijing, Shenzhen and Dalian to provide sales and service support to customers throughout China.
Fujitsu Microelectronics (Shanghai) Co., Ltd. offers an extensive range of products from microcontroller, application-specific integrated circuit (ASIC), application-specific standard product (ASSP), system-on-chip (SoC) to system memory, that can be supplied as product or complete solution. With technology resource centres and ASIC design support centres strategically located in Shanghai, Hong Kong, and Taiwan, as well as Heavy investments in design and engineering capabilities and application support resources, complemented by a regional network of design partners, suppliers and distributors, Fujitsu Microelectronics (Shanghai) Co., Ltd. can readily delivers innovative and value-added solutions and varied range of products to its target markets in China.
For more information, please see: http://www.fujitsu.com/cn/en/about/local/subsidiaries/fsp/about/

Marketing:Andrew Gan

Phone: Phone: 886 2-2719 2011
Fax: 886 2-2545 3690
E-mail: E-mail: Andrew.Gan@cn.fujitsu.com
Company:Fujitsu Microelectronics (Shanghai) Co., Ltd

Corporate Planning & Communications:Cao Miao

Phone: Phone: +021-6146-3688
Fax: +021-6335-1610
E-mail: E-mail: Marcom.sh@cn.fujitsu.com
Company:Fujitsu Microelectronics (Shanghai) Co., Ltd


Company names mentioned herein are trademarks or registered trademarks of their respective owners. Information provided in this press release is accurate at time of publication and is subject to change without advance notice.

Press Release ID: 2008-06-23
Date: 23 June, 2008
City: Shanghai
Company: Fujitsu Microelectronics (Shanghai) Co. Ltd.

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