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FDK’s DC/DC power modules deliver exceptional electrical and thermal performance. The technologies may be used in several application areas. Since each area requires different feature sets, there are different families specialized for those specific application area. These are the power modules of choice for Intermediate Bus Architecture (IBA) and Distributed Power Architecture applications that require high efficiency and high reliability in elevated temperature environments with low airflow.

This leading edge thermal performance results from electrical, thermal and packaging design that is optimized for high density circuit card conditions. Extremely high quality and reliability are achieved through advanced circuit and thermal design techniques and FDK’s state of the art in-house manufacturing processes and systems.

FDK Technology overview

The Sensei Series of isolated dc-dc power modules are in industry-standard footprints for isolated brick power modules. The Senpai Series and Tomodachi Series of non-isolated DC/DC power modules are also in industry-standard footprints for Point-of-Load (POL) power modules. The DK Series of non-isolated DC/DC power modules are FDK original design mini POL power modules.