Fujitsu Introduces Bluetooth® Smart Beacon for IoT Solutions San Jose, CA, United States, December 17, 2015 - Fujitsu Component America, Inc. today introduced a battery-powered Bluetooth Smart Beacon that can be paired with existing or OEM-developed Internet of Things (IoT) applications and other custom features for a complete, wireless beacon solution.
Fujitsu Adds Press-Fit Option to DDR4 DIMM Connector Series San Jose, CA, United States, November 18, 2015 - Fujitsu Components America today announced it has expanded its DDR4 DIMM connector series with the addition of a press-fit compliant pin socket.
Fujitsu Releases Miniature Bluetooth® Smart Module for IoT Solutions San Jose, CA, United States, October 27, 2015 - Fujitsu Component America, Inc. announces the availability of an ultra small Bluetooth® Smart module that is approximately 50 percent smaller than its predecessor, the MBH7BLZ02.
Fujitsu Releases Ultra Low Profile Thermal Printer Series San Jose, CA, United States, July 09, 2015 - Fujitsu Components America Inc. today announces the release of one of its smallest 24V thermal printer mechanism series, the FTP-6xGMCL series. The printers are targeted to OEMs developing compact self-service solutions for industrial, instrumentation, medical, retail, and transportation industries.
Fujitsu Adds Projected Capacitive Touch Panel Technology San Jose, CA, United States, June 02, 2015 - Fujitsu Components America, Inc. announces it is expanding its touch panel offering to include a series of projected capacitive touch panels. The addition to Fujitsu’s existing 4-, 5- and 7-wire, dual-touch analog resistive touch panels provides OEMs with a wider range of touch input solutions for a growing variety of applications.
Fujitsu Expands Grounding Spring Product Line for Mobile Designs San Jose, CA, United States, January 13, 2015 - Fujitsu Components America announced it has added two new, compact grounding spring connectors to its product offering to give designers more choices for the grounding requirements of printed circuit boards within the confines of mobile devices.
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