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Fujitsu Components America Press Releases

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November

August

  • Fujitsu’s Full-Featured SPP Bluetooth® Modules Simplify Wireless Integration Sunnyvale, CA, United States, August 24, 2010 - Fujitsu Components America, Inc. today introduced a series of ultra-miniature, Class 1 and Class 2 Bluetooth modules that allows designers to easily and cost-effectively add wireless capability to their designs. The new devices feature embedded Serial Port Profile (SPP) firmware, a compact footprint and a broad command/event list to simplify and reduce integration time while meeting a wide variety of performance requirements.

  • Fujitsu’s DDR3 DIMM Connector Design Enhances Memory Module Reliability Sunnyvale, CA, United States, August 03, 2010 - Fujitsu Components America, Inc. today released a DDR3 (Double Data Rate) DIMM (Dual Inline Memory Module) socket connector designed to reduce errors and intermittent faults associated with DDR3 memory modules.

May

  • Fujitsu Markets Windows® 7 Logo-Certified, Resistive Multi-Input Panels in North America Sunnyvale, CA, United States, May 24, 2010 - Fujitsu Components America, Inc., the first manufacturer to obtain Windows® 7 logo certification for a resistive multi-input touch panel, is now marketing those touch panels in North America. Already in production in Japan since August 2009, the new multi-input panels’ increased functionality promises to expand touch capability into many new applications and markets, including harsh environments.

  • Fujitsu Introduces Ultra-Compact Wireless LAN Module with Antenna Diversity Sunnyvale, CA, United States, May 24, 2010 - Fujitsu Components America, Inc. today announced the release of a compact, 802.11a/b/g SDIO wireless LAN module with antenna diversity, low power consumption and reduced footprint.

  • Fujitsu Releases Hard Surface, Film-Film Touch Panels for Mobile Applications Sunnyvale, CA, United States, May 17, 2010 - Fujitsu Components America Inc. today released a durable, Film-Film resistive touch panel series targeting mobile applications. The plastic touch panels are 30-40% lighter than Film-Glass panels, withstand greater input loads, and have 2x the life of typical Film-Film panels.

  • Fujitsu Adds Standard Sizes to its Self-Wetting Adhesive Protector Sheets for Touch Panels Sunnyvale, CA, United States, May 10, 2010 - Fujitsu Components America, Inc. today announced it is offering its self-wetting adhesive protector sheets (SWAPS) in standard sizes to fit popular LCD dimensions. The protector sheets offer a low-cost, readily available way to extend the life of any touch screen or flat panel during product use, testing or shipping.

April

  • Fujitsu’s New Thermal Printer Unit Targets Compact Self-Service Kiosks Sunnyvale, CA, United States, April 14, 2010 - Fujitsu Components America, Inc. today expanded its thermal printer offering with the release of a high-speed, three-inch receipt printer unit for compact, self-service devices and kiosks. This new printer unit has features that accelerate transaction times while providing long-term reliability, durability and drop-in design integration.

  • Fujitsu Expands Printer Line with Standalone, Ultra-High Speed, Label/Ticket Printer Sunnyvale, CA, United States, April 13, 2010 - Fujitsu Components America, Inc. today added a 3-inch, standalone label/ticket thermal printer capable of output speeds up to 260mm per second. This ultra-fast, reliable throughput improves transaction efficiency in Point-of-Sale and unattended kiosk applications as well as in light industrial, manufacturing, laboratory, distribution and warehouse environments.

March

February

  • Fujitsu Markets Wireless Module Products in North America Sunnyvale, CA, United States, February 23, 2010 - Fujitsu Components America, Inc. today announced that it is marketing a diverse range of wireless modules in North America to address core OEM design needs as the market for wireless mobile devices, portable media devices and industrial equipment steadily increases. Fujitsu brings innovation from many years of industry-leading Multi-Chip Module design and production experience, resulting in smaller wireless module package sizes that consume less power than competing products.