Module & Mobile Printed Circuit Boards
FICT has the capability to provide advanced technology Module & Mobile PCB design and manufacturing services. As the functionality and performance of modules and mobile communications improves, the demand for high-performance printed circuit boards increases. There have been continuing demands for reducing the size and number of layers in new products. Sophisticated interconnect technology has become essential for meeting these needs by improving the density and reliability of PCBs. FICT is the technology leader with solutions that enable its customers to migrate to new and complex designs, while reducing manufacturing time and total cost.
Product Information
- Module & Mobile Printed Circuit Board Manufacturing
-Up to 60 layers; In general 6 to 10 layers - Dimensions
-Up to 26" x 28" size
-Up to 0.3" thick
Product Features
- Thin core
- Embedded placement
- Flat pattern processing
- Parallel process
- Advanced materials
- New lamination process
- High density wiring by stacked via
Applications
- Computing (PCs)
- Consumer (Mobile phones, PDAs, and video games)
- Modules (Cameras, Videos, VCOs)
