Build-up PCB
MV (Multivia Technology) Series
This technology combines sequential lamination and build-up structure
- Sequential lamination is used to make high-performance, multi-layer PCBs for mounting high pin packages
- Build-up structure is used to make high-density PCBs for mounting fine pin pitch packages closely together,
By using MV technology we can address the following areas:
- High-speed
- High-density
- Design flexibility
- Layer reduction
- Cost Reduction
