Packaging Substrates
FICT has the capability to provide advanced technology Packaging Substrate design and manufacturing services. As the functionality and performance of network systems, high-end servers, and mobile communication devices improves, the demand for high-performance, high pin count packages is increasing. This increasing demand requires new technologies, which incorporate high pin count and also delivers performance via impedance control, low crosstalk, DC/AC resistance, and low VG impedance. Sophisticated interconnect technology has become essential for meeting these needs by improving the density and reliability of the substrates for LSI package and module boards. FICT is the technology leader with solutions that enable its customers to migrate to new and complex designs, while reducing manufacturing time and total cost.
Packaging Substrate Manufacturing
- ASIC, FPGA, and graphics
- Build-up substrate from 1-2-1 to 6-2-6
- 20 µm Line and Space (15 µm is proto)
- Coreless structure (Proto)
- 2500 pins substrate is under production
- Low CTE, High Modulus, Low loss materials
Product Features
- Coreless structure
- Advanced materials
- High density wiring by stacked via
Applications
- Computing (Servers, PCs, Storage)
- Industrial (Controllers, Valves, Switches)
- Medical (CT Scanners, Imaging, Data Devices)
- Gaming (Games, Graphics, Controllers)
