Foundry Service Press Releases
Advanced Packaging
- March 31, 2008 Sunnyvale, CA
- Fujitsu Introduces 65-Nanometer 10G SerDes from Prism Circuits
Sunnyvale, CA, March 31, 2008 – High-Speed Applications Among Key Focus of the U.S.-Based Fujitsu Semiconductor Manufacturing Services Business Group
- August 27, 2003 Tokyo
- Fujitsu to Consolidate Its Japan-Based Semiconductor Assembly and Testing Operations
Tokyo, August 27, 2003 – Fujitsu Limited today announced that it will consolidate its four semiconductor back-end assembly and testing subsidiaries in Japan into one newly-established company with four facilities. The new company, Fujitsu Integrated Microtechnology Limited, will focus on the back-end assembly and testing of logic chips, integrating the unique product lines and technological strengths of each of the four units into one highly competitive organization with improved efficiencies.
- July 15, 2002 San Jose, CA
- Fujitsu Introduces Industry's Smallest Chip-Size Module with Advanced System-in-Package Technology
San Jose, CA, July 15, 2002 – SiP Technology Enables MCPs as Small as their Largest Individual Device
- May 20, 2002 Santa Clara, CA
- ISSI Introduces New Stacked Multi-Chip Modules for Mobile Communications Market
Santa Clara, CA, May 20, 2002 – Integrated Silicon Solution, Inc. (Nasdaq: ISSI), a leader in advanced memory solutions, today introduced a new family of stacked multi-chip package (MCP) Flash and SRAM memory products. The new products combine ISSI's 8Mb low-power asynchronous SRAM with Fujitsu's 64Mb or 32Mb NOR-type Flash memory in a stacked multi-chip module with fine-pitch ball grid array (FBGA).
- April 23, 2002 Tokyo and Chandler, AZ
- Amkor & Fujitsu Announce Factory Outsourcing Venture
Tokyo and Chandler, AZ, April 23, 2002 – Amkor Technology, Inc. (Nasdaq: AMKR) and Fujitsu Limited (TSE: 6702) have signed a non-binding memorandum of understanding calling for Amkor's staged equity purchase of Fujitsu's semiconductor assembly and test operation located in Kagoshima, Japan. The agreement would significantly enhance Amkor's penetration of the Japanese market for outsourced semiconductor assembly and test while enabling Fujitsu to improve production competitiveness and focus on its core business operations.
- March 25, 2002 San Jose, CA
- Fujitsu Introduces Industry's First Eight-Stacked Multi-Chip Package for Mobile
San Jose, CA, March 25, 2002 – IC Cards, Compact Hard Drives Now Support Three-stacked Chips in One Package
- February 20, 2002 San Jose, CA
- Fujitsu Introduces High-Capacity Four-Stacked MCP and Two-Stacked MCP
San Jose, CA, February 20, 2002 – Two New MCPs Provide Industry's Largest Memory Capacity for Mobile Devices
- October 10, 2001 Santa Clara, CA
- Fujitsu Showcases New Bump FCBGA, CSPs, Stacked Multi-Chips
Santa Clara, CA, October 10, 2001 – Fujitsu Microelectronics Showcases New Bump FCBGA, CSPs, Stacked Multi-Chips at Fabless Semiconductor Association Suppliers Expo, First 800mm Square Die, New Fine Pitch Bump Packages Ready by Year End
- July 16, 2001 San Jose, CA
- Fujitsu Features Package Solutions Including Bump FCBGA, CSPs, Lead-Free, Stacked Multi-Chip
San Jose, CA, July 16, 2001 – Fujitsu Microelectronics, Inc. (FMI), a world leader in advanced semiconductor packaging technologies, will showcase its new Flip-Chip Ball Grid Array (FCBGA) lead-free packages and other chip scale packages (CSP) at the annual SEMICON West, July 18-20, at the San Jose Convention Center (booth number 9516).
- July 12, 2001 San Jose, CA
- Fujitsu Delivers Industry's First Copper FCBGA Packaging to Altera Corporation
San Jose, CA, July 12, 2001 – Fujitsu Microelectronics, Inc. (FMI) today announced it has delivered the first copper interconnect Flip-Chip Ball Grid Array (FCBGA) package for Altera Corporation's (NASDAQ:ALTR) Programmable Logic Devices (PLDs).
- May 22, 2001 San Jose, CA
- Fujitsu Announces First Packaging Options without Lead (Pb)
San Jose, CA, May 22, 2001 – Fujitsu Microelectronics, Inc. (FMI) today introduced its new lead-free Ball Grid Array (BGA) and Quad Flat Pack packages, the first products in the company's program to supply only lead-free components and packages. A broad range of ASIC, memory, microcontroller and other LSI devices are now available in these lead-free packages.
- March 13, 2001 San Jose, CA
- Fujitsu Announces Capacity Expansion of Wafer Bumping and FlipChip-BGA Assembly Services
San Jose, CA, March 13, 2001 – Flip-chip advanced packaging is key feature for high-frequency devices
Wafer Fab Service
- March 31, 2008 Sunnyvale, CA
- Fujitsu Introduces 65-Nanometer 10G SerDes from Prism Circuits
Sunnyvale, CA, March 31, 2008 – High-Speed Applications Among Key Focus of the U.S.-Based Fujitsu Semiconductor Manufacturing Services Business Group
- May 24, 2007 Tokyo, Japan, Sunnyvale and Newport Beach, CA
- Jazz and Fujitsu to Collaborate on Providing Complete Solution for 90nm and 65nm RF CMOS Foundry Customers
Tokyo, Japan, Sunnyvale and Newport Beach, CA, May 24, 2007 – IP Providers Transmeta and Tensilica to Join Fujitsu in Booth 833
- January 26, 2007 Sunnyvale, CA
- Fujitsu to Feature Advanced 65-Nanometer Process Technology, 10Gbps Ethernet Switch Chip at DesignCon 2007
Sunnyvale, CA, January 26, 2007 – IP Providers Transmeta and Tensilica to Join Fujitsu in Booth 833
- October 10, 2006 San Jose, CA
- Fujitsu to Feature World-class 65-Nanometer Process Technology for Advanced Networking, Mobile Applications at 12th Annual
FSA Conference
San Jose, CA, October 10, 2006 – CS200HP / 200A, Part of Fujitsu’s Turnkey Services for Customers, at Booth #410
- September 15, 2006 Tokyo, Japan
- Fujitsu and Advantest to Establish Joint Venture to Create Semiconductor Prototypes Using Electron Beam Direct Lithography
Tokyo, Japan, September 15, 2006 – Fujitsu Limited and Advantest Corporation today announced plans to establish a joint venture to create prototype semiconductors by using electron beam direct lithography.
- June 13, 2006 Tokyo, Japan
- Fujitsu, NEC Electronics, Renesas, and Toshiba to Aim for Standardization of Semiconductor Process Technology for Next-Generation
LSI
Tokyo, Japan, June 13, 2006 – Fujitsu Limited ("Fujitsu"), NEC Electronics Corporation ("NEC Electronics"), Renesas Technology Corp. ("Renesas Technology"), and Toshiba Corporation ("Toshiba") today announced that they have agreed to seek to define a standard process technology that can be applied to the manufacture of advanced system LSIs at the 45-nanometer (nm)* generation and beyond.
- June 13, 2006 Tokyo, Japan
- Fujitsu and Lattice Strengthen Partnership
Tokyo, Japan, June 13, 2006 – Fujitsu Limited and Lattice Semiconductor Corporation today announced that they have signed a distribution agreement in which Fujitsu Devices Inc. will be added as an authorized distributor of Lattice's FPGA/PLD products in Japan.
- June 13, 2006 Sunnyvale, CA
- Fujitsu to Feature Success at 65-Nanometer Process Technology at Fabless Semiconductor Association Forum June 14
Sunnyvale, CA, June 13, 2006 – “Fujitsu at 65nm” Presentation to Focus on Challenges of Deep Submicron Process
- February 6, 2006 Sunnyvale, CA
- Fujitsu to Highlight New 65-Nanometer Process Technologies, 10 Gigabit Ethernet and the WiMAX SoC at Annual DesignCon 2006,
Booth 641
Sunnyvale, CA, February 6, 2006 – “65nm CMOS Process Technology” TecPreview Session Set for Feb. 7 at 10:15 a.m.
- January 11, 2006 Tokyo, Japan
- Fujitsu to Construct New Fab for Logic Chips Employing 65nm Process Technology and 300mm Wafers
Tokyo, Japan, January 11, 2006 – Fujitsu Limited today announced that it will construct a new fab to mass-produce logic semiconductors employing leading-edge 65-nanometer (nm) process technology and 300 millimeter (mm) wafers.
- November 2, 2005 Fremont, CA and Tokyo, Japan
- Fujitsu to Manufacture Leading-edge 3D Graphics Processors for S3 Graphics
Fremont, CA and Tokyo, Japan, November 2, 2005 – Fujitsu's 90 nanometer technology enables high performance graphics chips featuring high speeds and low power consumption
- October 3, 2005 Sunnyvale, CA
- Fujitsu to Feature Industry-Leading Process Technology, Packaging Services in Booth 535 at Annual Fabless Semiconductor Association
Conference
Sunnyvale, CA, October 3, 2005 – Senior VP Keith Horn to Present "Beyond the IDM Business Model" October 5
- September 20, 2005 Sunnyvale, CA
- Fujitsu Introduces World-class 65-Nanometer Process Technology for Advanced Server, Mobile Applications
Sunnyvale, CA, September 20, 2005 – CS200/CS200A Offers Top Performance, Low Power with 25 Percent Gate Size Reduction
- April 18, 2005 Sunnyvale, CA
- IDM Business Model, Advanced Design and Technology Processes Detailed in New White Paper from Fujitsu
Sunnyvale, CA, April 18, 2005 – Describes Complete Capability Portfolio for 300mm, 90nm Custom Silicon
- March 23, 2004 Tokyo
- Fujitsu to Manufacture Leading-Edge FPGA Products for Lattice Semiconductor
Tokyo, March 23, 2004 – Lattice Semiconductor Announces FPGA Technology, Product Roadmap; Plans to Invest in Fujitsu's New 300mm Fab
- March 19, 2004 Tokyo
- Fujitsu to Construct New Facility for Mass Production of Logic Chips Using 90nm and 65nm Process Technology
Tokyo, March 19, 2004 – New fab will use 300mm wafers
- March 29, 2002 Tokyo
- Fujitsu Launches World's First 90-Nanometer LSI Process Pilot roduction Line at Akiruno Technology Center
