Advanced Packaging
Technologies
- Chip Scale Packages (FBGA) Fact Sheet (164KB PDF)
- Flip Chip (FC-BGA) Fact Sheet (117KB PDF)
- Flip Chip (FC-BGA) Multimedia Presentation (video)
- Stacked/Multi-Devices (Stacked MCP) Fact Sheet (149KB PDF)
- Wafer Bumping Fact Sheet (494KB PDF)
- Wafer Bumping Multimedia Presentation (Video)
- Wafer Level Packaging (Super CSP) Fact Sheet (144KB PDF)
- Wireless Packages (BCC and BCC++) Fact Sheet (91KB PDF)
