Advanced Packaging
Press Releases
Advanced Packaging Press Releases
- March 31, 2008 Sunnyvale, CA
- Fujitsu Introduces 65-Nanometer 10G SerDes from Prism Circuits
Sunnyvale, CA, March 31, 2008 – High-Speed Applications Among Key Focus of the U.S.-Based Fujitsu Semiconductor Manufacturing Services Business Group
- August 27, 2003 Tokyo
- Fujitsu to Consolidate Its Japan-Based Semiconductor Assembly and Testing Operations
Tokyo, August 27, 2003 – Fujitsu Limited today announced that it will consolidate its four semiconductor back-end assembly and testing subsidiaries in Japan into one newly-established company with four facilities. The new company, Fujitsu Integrated Microtechnology Limited, will focus on the back-end assembly and testing of logic chips, integrating the unique product lines and technological strengths of each of the four units into one highly competitive organization with improved efficiencies.
- July 15, 2002 San Jose, CA
- Fujitsu Introduces Industry's Smallest Chip-Size Module with Advanced System-in-Package Technology
San Jose, CA, July 15, 2002 – SiP Technology Enables MCPs as Small as their Largest Individual Device
- May 20, 2002 Santa Clara, CA
- ISSI Introduces New Stacked Multi-Chip Modules for Mobile Communications Market
Santa Clara, CA, May 20, 2002 – Integrated Silicon Solution, Inc. (Nasdaq: ISSI), a leader in advanced memory solutions, today introduced a new family of stacked multi-chip package (MCP) Flash and SRAM memory products. The new products combine ISSI's 8Mb low-power asynchronous SRAM with Fujitsu's 64Mb or 32Mb NOR-type Flash memory in a stacked multi-chip module with fine-pitch ball grid array (FBGA).
- April 23, 2002 Tokyo and Chandler, AZ
- Amkor & Fujitsu Announce Factory Outsourcing Venture
Tokyo and Chandler, AZ, April 23, 2002 – Amkor Technology, Inc. (Nasdaq: AMKR) and Fujitsu Limited (TSE: 6702) have signed a non-binding memorandum of understanding calling for Amkor's staged equity purchase of Fujitsu's semiconductor assembly and test operation located in Kagoshima, Japan. The agreement would significantly enhance Amkor's penetration of the Japanese market for outsourced semiconductor assembly and test while enabling Fujitsu to improve production competitiveness and focus on its core business operations.
- March 25, 2002 San Jose, CA
- Fujitsu Introduces Industry's First Eight-Stacked Multi-Chip Package for Mobile
San Jose, CA, March 25, 2002 – IC Cards, Compact Hard Drives Now Support Three-stacked Chips in One Package
- February 20, 2002 San Jose, CA
- Fujitsu Introduces High-Capacity Four-Stacked MCP and Two-Stacked MCP
San Jose, CA, February 20, 2002 – Two New MCPs Provide Industry's Largest Memory Capacity for Mobile Devices
- October 10, 2001 Santa Clara, CA
- Fujitsu Showcases New Bump FCBGA, CSPs, Stacked Multi-Chips
Santa Clara, CA, October 10, 2001 – Fujitsu Microelectronics Showcases New Bump FCBGA, CSPs, Stacked Multi-Chips at Fabless Semiconductor Association Suppliers Expo, First 800mm Square Die, New Fine Pitch Bump Packages Ready by Year End
- July 16, 2001 San Jose, CA
- Fujitsu Features Package Solutions Including Bump FCBGA, CSPs, Lead-Free, Stacked Multi-Chip
San Jose, CA, July 16, 2001 – Fujitsu Microelectronics, Inc. (FMI), a world leader in advanced semiconductor packaging technologies, will showcase its new Flip-Chip Ball Grid Array (FCBGA) lead-free packages and other chip scale packages (CSP) at the annual SEMICON West, July 18-20, at the San Jose Convention Center (booth number 9516).
- July 12, 2001 San Jose, CA
- Fujitsu Delivers Industry's First Copper FCBGA Packaging to Altera Corporation
San Jose, CA, July 12, 2001 – Fujitsu Microelectronics, Inc. (FMI) today announced it has delivered the first copper interconnect Flip-Chip Ball Grid Array (FCBGA) package for Altera Corporation's (NASDAQ:ALTR) Programmable Logic Devices (PLDs).
- May 22, 2001 San Jose, CA
- Fujitsu Announces First Packaging Options without Lead (Pb)
San Jose, CA, May 22, 2001 – Fujitsu Microelectronics, Inc. (FMI) today introduced its new lead-free Ball Grid Array (BGA) and Quad Flat Pack packages, the first products in the company's program to supply only lead-free components and packages. A broad range of ASIC, memory, microcontroller and other LSI devices are now available in these lead-free packages.
- March 13, 2001 San Jose, CA
- Fujitsu Announces Capacity Expansion of Wafer Bumping and FlipChip-BGA Assembly Services
San Jose, CA, March 13, 2001 – Flip-chip advanced packaging is key feature for high-frequency devices
