Advanced Packaging

Why Fujitsu’s advanced packaging services? Providing unmatched, one-stop, turnkey packaging services, Fujitsu is the acknowledged global leader in advanced packaging technology, innovation, patents and manufacturing techniques, enabling our customers to meet market demands today and in the future.

Fujitsu’s advanced packaging and testing services including complete in-house turnkey package design, simulation, assembly and testing.

• Technology leadership and cost-effective manufacturing maximize our customers’ competitive advantage.
• Our leadership in system-integrated packaging is unmatched. Technologies include wafer bumping, flip chip, enhanced RF, stacked, and wafer-level packaging.
• Global manufacturing support services include more than five million square feet of manufacturing floor space in over 20 dedicated factories.
• Lead-free packaging solutions maintain the company’s high standards for performance, reliability and quality.

Fujitsu's packaging solutions enable designers to reduce size and space requirements, producing higher levels of integration and performance. Options include:

• Flip-chip Ball Grid Arrays (FC-BGA)
  GHz range packaging solutions
• Fine-pitch Ball Grid Arrays (FBGA)
  Chip-Scale Packaging (CSP) solutions

Applications

• FC-BGA: Internet Router/Server, Workstation Public Transmission
• FBGA: Cellular Phones, DVC, DSC