Semiconductor Manufacturing Services

ASIC

White papers

• 2010/05
  The Fujitsu 56GSa/s Analog-to-Digital Converter Enables 100GbE Transport

  A 100Gbps coherent receiver needs four 56GSa/s Analog-to-Digital Converters (ADCs) and a tera-OPS DSP that dissipates only tens of watts. This paper discusses the forces pushing towards a single-chip CMOS solution. The paper also introduces the Fujitsu ultra-fast CMOS ADC, which provides the enabling technology for 100Gbps Ethernet and OTU-4 transport systems using coherent receivers.

• 2009/09/04
  The Fujitsu ASIC Platform: Combining Engineering Expertise with Best-in-Class Tools and Process Technology to Deliver Cost-Efficient Custom Silicon

  Advanced ASIC (Application Specific Integrated Circuit) development today requires complex and expensive design tools, leading-edge process technologies, and experienced engineering teams. Some large companies can commit the resources needed to acquire the expertise, support a sizable design team, and invest in the complete tool chain and development flow, all the way from circuit design to Graphic Data Systems (GDS) and beyond. This option, known as Customer Owned Tooling (COT), is a good choice for companies that can amortize costs over many products that are manufactured in high volumes for broad markets.
  

Articles

• 2008
  High-speed Interface Technology for Image Data Transmission

  It is now possible to handle high-resolution data in consumer products such as full HD flat-screen TVs. As such, the transmission of large volumes of data between and inside these devices is required. However, various problems have arisen in data transmission using the legacy CMOS interface, revealing its limits. This article presents various high speed interface technologies that are beginning to be adopted in order to replace it.

• 2008
  SoC Design Environment RDF V3.0 that Supports Low-power Designs

  Recently, the demand for low power consumption LSIs has been increasing constantly. In concurrence with process miniaturization, the leak current emitted while the transistor is OFF has been increasing and has now reached a level where it can no longer be ignored in products in which battery lifetime is important, such as mobile products. In this context, Fujitsu has released RDF v3.0, which includes a function to facilitate low-power design in our conventional LSI Design Flow RDF. This article introduces the low-power technology supported by RDF v3.0.

Fact Sheets

• Super-High-Speed 56GSa/s Analog-to-Digital Converter

  The Fujitsu super-high-speed CMOS ADC provides the enabling technology for upcoming telecommunication applications such as 100G Ethernet and OTU-4 transport systems using coherent receivers

• Low Power, 10-Bit, 50MS/s, ADC IP

  The Fujitsu's Analog-to-Digital Converter (ADC) IP is designed to provide high efficiency and ultra-low power for various mixed-signal applications, including portable ultrasound devices, mobile basebands, TV demodulators, industrial automation and robotics

• CE81 series / 0.18 µm

  Fujitsu’s CE81 is a series of high performance, 0.18μm (0.13μm Leff) CMOS embedded arrays that include full support of diffused high-speed RAMs, ROMs, analog, mixed-signal macros, and a variety of embedded functions.

• CE71 series / 0.25 µm

  Fujitsu’s CE71 is a series of high-performance, 0.18μm Leff CMOS embedded arrays that include full support of diffused high-speed RAMs, ROMs, mixed-signal macros, and a variety of other embedded functions. The CE71 series offers density and performance similar to those of standard cells, yet provides the time-to-market advantage of gate arrays. The CE71 series devices include 44μm, 66μm, or 88μm pad pitch for a cost-effective solution for both pad-limited and core-limited designs.

• 2.5Gbps Transceiver Macro with CDR

  Fujitsu’s triple mode parallel transceiver is a physical I/O interface macro for ASICs that performs high-speed back plane data communication, operating at low power dissipation. The triple data transfer rates, 2.5G/1.25G/622M bps, can be selected dependi

• 3.125Gbps Parallel CDR Transceiver (0.11µm)

  Fujitsu’s parallel transceiver, is a seletable 2/4/8/16- channel CDR receiver and transmitter array intended for ASICs that perform at high bandwidth data communications.

• 3.125Gbps Parallel CDR Transceiver (0.18µm)

  Fujitsu’s parallel transceiver, which is available in 2/4/8/16-channel width CDR receiver and transmitter arrays, is for ASICs that perform at high bandwidth data communications. The macro meets SONET/SDH OC-48 jitter tolerance mask requirement. The macro

• 3.125Gbps x 4 Parallel Transceiver (0.11µm)

  The Fujitsu’s XAUI macro is for ASICs that perform at high bandwidth data communication.

• 3.125Gbps x 4 Parallel Transceiver (0.18µm)

  The Fujitsu’s XAUI macro is for ASICs that perform at high bandwidth data communication.

• SERDES Framer Interface Level-4

  Fujitsu's SFI4-1.0 macro enables the interface of any two chips at an aggregate of 10 to 12.5Gbps in each direction. Sixteen 622/780 Mbps differential data lines (plus one clock) are provided in the transmit direction, and another sixteen (plus one clock)

• SERDES Framer Interface Level-5

  Fujitsu’s SFI-5 compliant transceiver macro is a 17- channel physical I/O interface macro for ASICs that perform high bandwidth data communication while operating at low power consumption. The transceiver consists of a 17-channel transmitter unit, a 17-ch

• System Packet Interface Level-4

  The SPI-4 interface core enables the interconnection of physical layer devices to link layer devices in 10Gb/s POS, ATM, and Ethernet applications.
  

• ASIC Mixed-Signal and Analog Macros

  To achieve the highest level ofsystem integration, Fujitsu offers avariety ofanalog and mixed-signal macros for customer use inconjunction with its Embedded Arrays and Standard Celllibraries. Data communications, networking, graphics, anddigital audio/vid

• 10/100 Mbps Ethernet MAC Core

  The 10/100 MAC core is part of the Fujitsu IPWare™ Library. The 10/100 MAC core is a PAUSE Flow Control Ethernet Media Access Controller (MAC) capable of both 10 and 100 Mbps data operation.

• ARC Processor Core

  ARC is comprised of a Base RISC Engine, the ARC Extension Library, the Architect, integrated test suites, multi-interface architecture, the ARC Co-design toolset, a complete software development toolchain, and both hardware
  and software emulators. Provide

• ARM7TDMI™ Processor Core

  The ARM7TDMI embedded CPU core is part of Fujitsu’s IPWare™ Library. The Fujitsu ARM7TDMI processor core, developed by ARM, is implemented in Fujitsu’s 0.25µm process technology. This core contains all of the ARM7TDMI processor features, including a 32-bi

• PCI Peripheral Core

  The PCI Synthesizable Core is a part of the Fujitsu IPWare™ Library. The Fujitsu PCI Cores are RTL synthesizable modules that provide an interface between an application and the PCI bus. All PCI protocol and timing requirementsare handled by the core, whi

• USB Function Core Fac

  The USB Function Core is a synthesizable core and is part of the Fujitsu IPWare™ Library. This core is fully compliant with revision 1.0 of the USB specification.

• USB Host Controller Core

  The USB Host Controller is a synthesizable core and is part of the Fujitsu IPWare™ Library.

• USB 2.0 Device Controller Macro

  – Link
  • Protocol Engine (UDC-20) is a fully synthesizable soft core that supports high-speed (480 Mbps), full-speed (12Mbps) and low-speed (1.5Mbps) signaling bit rates.
  • UTMI (USB 2.0 Transceiver Macrocell Interface) enables connection with discrete PH

Data Sheets

• CS302 Series / 40 nm

  The CS302 series of 40 nm standard cells is a line of CMOS ASICs that satisfy demands for lower power
  consumption, higher speed and higher integration.
  These cells offer the minimum level of leakage current in the semiconductor industry, and are able to implement
  a mixture of core transistors with three different threshold voltages, as appropriate for the applications
  ranging from handheld terminals to digital audiovisual equipment.
  The integration level in this series is twice the CS201 series with lower power consumption.

• CS201 Series / 65 nm

  The CS201 series of 65 nm standard cells is a line of CMOS ASICs that satisfy demands for lower power
  consumption and higher integration. These cells offer the minimum level of leakage current in the semiconductor
  industry, and are able to implement a mixture of core transistors with three different threshold voltages, as
  appropriate for the applications ranging from handheld terminals to digital audiovisual equipment.
  The integration level in this series is twice the previous series with lower power consumption.

• CS101 Series / 90 nm

  CS101 series, a 90 nm standard cell product, is a CMOS ASIC that satisfies user’s demands for lower power
  consumption and higher speed. The leakage current of the transistors is the minimum level in the industry. Three
  types of core transistors with a different threshold voltage can be mixed according to user application.
  The design rules match industry standards, and a wide range of IP macros are available for use.
  As well as providing a maximum of 91 million gates, approximately twice the level of integration achieved in
  previous products, the power consumption per gate is also reduced by about half to 2.7 nW. Also, using the highspeed
  library increases the speed by a factor of approximately 1.3, with a gate delay time of 12 ps.

• CS91 Series / .011µm

  The CS91 series 0.11 μm CMOS standard cell is a line of highly integrated CMOS ASICs featuring high speed
  and low power consumption. This series incorporates up to 48 million gates which have a gate delay time of 16
  ps, resulting in both integration and speed about three times higher than conventional products.

• CS86 Series / 0.18 µm

  The CS86 series of 0.18 μm standard cells is a line of CMOS ASICs based on higher integration implemented
  by introducing wiring pitch reduction technology and on I/O pad placement technology to the conventional CS81
  series.
  The CS86 series has three types of cell sets (CS86MN, CS86MZ, and CS86ML), covering a variety of applications,
  from portable devices requiring low power consumption to image processors requiring large-scale circuitry and
  high speed.The three types of cell sets can be contained on one chip, allowing those system LSIs to be implemented
  which require low power consumption as well as high-speed operation for certain types of processing.

• CS81 Series / 0.18 µm

  The CS81 series 0.18 μm CMOS standard cell is a line of highly integrated CMOS ASICs featuring high speed
  and low power consumption.
  This series incorporates up to 40 million gates which have a gate delay time of 11 ps, resulting in both integration
  and speed about three times higher than conventional products.
  In addition, CS81 can operate at a power-supply voltage of down to 1.1 V, substantially reducing power consumption.

• CE77 series / 0.25 µm

  The CE77 series 0.25 μm CMOS embedded array is a line of highly integrated CMOS ASICs featuring high speed
  and low power consumption at the same time.
  CE77 series is available in 15 frames with the enhanced lineup of 470 K to 6980 K gates.

Foundry Services

White papers

• 2009/03/30
  The PSP Model in the RF CMOS Design Kit

  While the Penn State Philips (PSP) transistor model is rightly hailed as an excellent alternative to traditional BSIM models for RFIC design, RF designers need to be aware of how PSP models relate to actual device behavior. PSP models do require some judgment on the part of model developers. Equally important is an understanding of the way these models are used in an RF process design kit (PDK).

• 2008/11/12
  Motivation for RF Integration

  While CMOS technology has made great strides in its ability to fabricate radio frequency (RF) circuitry, many RF chip designers have yet to take advantage of this capability. After long relying on more expensive technologies such as silicon germanium (SiGe) and gallium arsenide (GaAs), RF designers who transition to the latest RF CMOS processes gain the enormous advantages of full system-on-a-chip (SoC) integration.

• 2006/09
  High-Performance / Low-Power 65nm CMOS Technology CS200 / CS200A

  This paper describes Fujitsu's CS200/CS200A series 65nm CMOS technology with a focus on the technology's improved performance and low power consumption. These advantages result from the technology's ability to achieve more than twice the density of transistor packing compared to 90nm technology as well as Fujitsu's advanced copper and ultra-low-k material (ULK) technology. The ULK material serves as an inter-level dielectric that reduces parasitic interconnect capacitance compared to previous technologies and thus significantly improves speed and power characteristics. The paper also describes Fujitsu's wide range of packaging choices and rich IP portfolio for use with the CS200/CS200A technology.

• 2005/04
  Your Best Choice for a 300mm, 90nm Foundry is Fujitsu

  This paper discusses Fujitsu's Integrated Device Manufacturing (IDM) service business model. IDM is designed to provide specific services – ranging from flexible design methodologies to a comprehensive set of IPs – as part of development alliances tailored to specific customer needs.

Fact sheets

• LCOS Backplane Process Fact Sheet

  LCOS Backplane Process features, CMOS Image Sensor Process features, High Voltage Process

• The Fujitsu Analog and RF CMOS Technology

  Building on Fujitsu’s expertise in leading-edge CMOS processes and analog design capabilities, the company’s RF CMOS technologies are optimized for wireless networks, cellular communication, WiMAX, digital multi-media broadcast, and navigational applications.

Advanced Packaging Services

Brochures

• IC Package

  Packaging solutions enable customers to reduce size and space requirements. The packages such as CSP (Chip Size Package or Chip Scale Package) and BGA (Ball Grid Array) support high-density wiring technology and are widely used in the market. Miniaturization has forced the use of new approaches in die packaging in order to achieve the
  smallest possible solutions. Fujitsu has launched the mass-production of SON packages -- the world's smallest level. Fujitsu has a mass-production lineup of super compact packages such as FBGA (Fine Pitch BGA) and WL-CSP (Wafer Level CSP) and beyond. The high pin count packages, PBGA（ Plastic BGA） and TEBGA (Thermal Enhanced BGA) have been mass-produced in order to fulfill the size and weight limitations, of, for example, portable equipment.

Presentations

• Fujitsu Lead-free Package (Presentation)

  Fujitsu Lead Free Package Specification: Ecologically friendly package with lead being eliminated from its terminal-use material and improved heat resistivity.

Videos

• Wafer Bumping Multimedia Presentation (Video)

  Wafer Bumping Multimedia Presentation

Fact sheets

• Stacked/Multi-Devices (Stacked MCP)

  Stacked Multi-Chip Package (Stacked MCP) is one of the most suitable chip scale packages for wireless applications. Its advantage is the compact stacked chip configuration. In the Flash memory and SRAM configuration, the pin layout can accomodate a 128 MB

• Wafer Bumping

  Wafer bumping services are offered as a preparatory step for flip-chip bonding or as bumping
  service alone. The types of solder bumping available include high lead solder, eutectic solder and
  lead free solder. Lead free bump, which is composed of tin-silv

• Wafer Level Packaging (Super CSP)

  Super Chip Scale Package (SCSP) is a wafer level package that is a true chip size package. It provides a potential solution for “known good die‿, or one test point operation as compared to two. In single chip packaging, it is customary to have testing at

• Wireless Packages (BCC and BCC++)

  The size and performance characteristics of Bump Chip Carrier (BCC) package make it well suited for RF devices, wide area networks, and DWDM systems. BCC is a molded, wire-bonded, leadless Chip Scale Package, and has terminals that are thinly plated on to