DESCRIPTION

Fujitsu provides semiconductor packages as a kind of "interposers" for protecting semiconductor devices and getting the full benefit of them. Fujitsu has developed and released a diversified series of "general-purpose package families" supporting a wide range of applications to suit customers' needs. The packages include through-hole type packages such as DIPs, ZIPs, and PGAs; QFPs and SOPs that contributed to setting the trend of surface mounting; and multipin QFPs, TCPs, and SVPs supporting high-tensity mounting. In addition, Fujitsu has developed and provided custom packages, cards, and modules for specific customers. The Package Guide contains the Device-Package Cross Reference, Package Contents and Tube and Tray Quantities.

DOCUMENTATION

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PDF Package - Device Cross Reference (12 pages, 45 KB)

PDF Package - Integrated Circuits (10 pages, 4405 KB)

PDF Package Contents Overview Manual X1 (236 pages, 10661 KB)

PDF Packing for Shipment (14 pages, 984 KB)

PDF Socket Guide (15 pages, 69 KB)

PDF Tube and Tray Quantities (1 page, 6 KB)

PACKAGE SEARCH

To search for a specific package specification or code, please use the link below.

Package Search (Fujitsu Global)