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Low Power Consumption Memory for Digital Consumer Electronics (x64, Low Power DDR SDRAM, SiP-optimized) 256M-bit & 512M-bit Consumer FCRAM

Fujitsu 256Mbit and 512Mbit Consumer FCRAM features very low power and high throughput for digital consumer electronics products. They are ideal for system-in-package (SiP) designs that feature small mounting spaces on circuit boards and reduced component costs. They also support an operating temperature of up to 125°C. They offer the best value memory systems for digital consumer electronics.

Features

Operating Temperature of up to 125°C

  • Conventional SDRAM such as DDR2 SDRAM or Low Power DDR SDRAM can only support a maximum operating temperature of 95°C, which causes a thermal design problem in high power consuming SoCs. The Fujitsu high temperature FCRAM with maximum 125°C operation solves the thermal design problem and SiP and can be used for variety of applications.

    PDF Case Study of SiP Thermal Design (54KB)

Low Power Consumption

  • DDR2 SDRAM and other high-speed memory interfaces require a termination resistor to maintain stable signals. These resistors are responsible for much of the total power consumption in such applications. The new FCRAM eliminates the need for resistors by using a wide 64-bit I/O bus, so that it can run at a lower operating frequency. The result is performance equivalent to two 16-bit DDR2 SDRAMs with 16-bit I/O interfaces, with about one full Watt less total power consumption. This equates to a 70 percent reduction compared with prior requirements. A significant proportion of the DDR2 SDRAM’s total power consumption has been accounted for by the terminating resistors; eliminating them makes a significant contribution to power savings.

    PDF Power Consumption Comparison between DDR2/LPDDR and FCRAM (50KB)

High Data Bandwidth

Main Specifications

Part Number MB81EDS256545 MB81EDS516545
Organization 1M-word x 64-bit x 4-bank 2M-word x 64-bit x 4-bank
Interface Low Power DDR      
Supply Voltage 1.7V to 1.9V          
Operating Voltage (Tj) -10°C to +125°C      
Burst Operating Frequency Tj≤105°C       216MHz (Max.)
Tj≤125°C       200MHz (Max.)
Data Transfer Rate     Tj≤105°C      3.46GByte/s (Max.)
   Tj≤125°C       3.2GByte/s (Max.)

Technical Support

Fujitsu offers technical support tools to help customers’ product development. They include simulation models for memory verification, a memory controller for interface support, and a FPGA optional evaluation board.

  • Memory Controller
  • FPGA Evaluation Board (Optional Board)
  • Simulation Model
    - IBIS Model
    - Verilog Model
    - SOMA Model (Supported by Denali Software, Inc.)
    - BFM (Bus Function Model)
    - ESL (Electric System Level)

256M-bit Consumer FCRAM Family for 125ºC Sip

Density (Bit) Interface I/O (bit) Supply Voltage (V) Operating Frequency (MHz) Junction Temp.
Tj (ºC)
Part Number
256M SDR x 32 1.7 to 1.95 116 -10 to +125 MB81ES253245
x 64 1.7 to 1.95 116 -10 to +125 MB81ES256445
DDR x 32 1.7 to 1.95 216 -10 to +125 MB81EDS253245
x 64 1.7 to 1.95 216 -10 to +125 MB81EDS256445
MB81EDS256545
with special function

512M-bit Consumer FCRAM Family for 125ºC Sip

Density (Bit) Interface I/O (bit) Supply Voltage (V) Operating Frequency (MHz) Junction Temp.
Tj (ºC)
Part Number
512M DDR x 64 1.7 to 1.9 216 -10 to +125 MB81EDS516445
MB81EDS516545
with special function